Specific Process Knowledge/Etch/DRIE-Pegasus/SPTSdocs: Difference between revisions

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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/SPTSdocs click here]'''
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== SPTS documents on hardware ==
 
[[Media:Pegasus_sheet_V8.pdf‎ |Hardware Information - Overview]].
 
[[Media:Pegasus_specification_v2.4.pdf|Hardware Information - Detailed]].
 
[[Media:Pegasus_System_Description_&_Differentiation.pdf|The Advantages the Pegasus has over existing Si etchers]].
 
[[Media:Macs_v2.pdf|Robot Handling System Information ]].
 
== Process applications ==
 
[[Media:Aerospace.pdf‎ |MEMS in Aerospace]].
 
[[Media:Bio-medical.pdf|Bio Medical]].
 
[[Media:Energy.pdf|MEMS in Energy]].
 
[[Media:Nanotechnology.pdf|Nanotechnology]].
 
[[Media:Packaging-etch.pdf‎ |Packaging Applications]].
 
[[Media:Appl-sheets-4_markets.pdf|General Applications]].

Latest revision as of 11:33, 28 June 2023

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