Specific Process Knowledge/Thermal Process/Furnace: Multipurpose annealing/Acceptance test: Difference between revisions

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==Multipurpose Anneal furnace acceptance test==
==Multipurpose Anneal furnace acceptance test==


The acceptance for the Multipurpose Anneal furnace was performed in November 2014 by ATV Technologie and Danchip.
The acceptance for the Multipurpose Anneal furnace was performed in November 2014 by ATV Technologie and DTU Nanolab.


At the acceptance test a dry oxide layer was grown on a boat of 150 mm wafers. The oxide growth was repeated three times
At the acceptance test a dry oxide layer was grown on a boat of 150 mm wafers. The oxide growth was repeated three times
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'''Oxidation time''': 80 min
'''Oxidation time''': 80 min


'''Temperature''': 1050 <sup>o</sup>C (all temoperature zones)
'''Temperature''': 1050 <sup>o</sup>C (all temperature zones)


'''O<sub>2</sub> flow''': 1 slm
'''O<sub>2</sub> flow''': 1 slm


The oxidation has been done with 150 mm wafers, and with 30 wafers in the furnace.  
The oxidation has been done with 150 mm wafers. The number of wafers in the boat was 30.  


Wafer 4 (towards the door), wafer 16 and wafer 28 (towards the service area) were measured in 13 points on each wafer using the M-2000V ellipsometer.
Wafer 4 (towards the door), wafer 16 and wafer 28 (towards the service area) were measured in 13 points using the M-2000V ellipsometer.


==Results==
==Results==
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====Refractive index====
====Refractive index====

Latest revision as of 11:28, 2 February 2023

Feedback to this page: click here

This page is written by DTU Nanolab internal

Multipurpose Anneal furnace acceptance test

The acceptance for the Multipurpose Anneal furnace was performed in November 2014 by ATV Technologie and DTU Nanolab.

At the acceptance test a dry oxide layer was grown on a boat of 150 mm wafers. The oxide growth was repeated three times

For each run the oxide thickness and refractive index were measured on three of the wafers, and the standard deviation and non-uniformity were calculated for each wafer, over the boat and from run to run.

Oxidation parameters

Recipe: "vr_dryOx_1000C_120min_150_5Wafer_D1_mit_Inliner_oPurgering.ATV"

Oxidation time: 80 min

Temperature: 1050 oC (all temperature zones)

O2 flow: 1 slm

The oxidation has been done with 150 mm wafers. The number of wafers in the boat was 30.

Wafer 4 (towards the door), wafer 16 and wafer 28 (towards the service area) were measured in 13 points using the M-2000V ellipsometer.

Results

Oxide thickness

Date Wafer 4 Wafer 16 Wafer 28 Center point only
Average oxide thickness [nm] St. deviation Non-uniformity [%] Average oxide thickness [nm] St. deviation Non-uniformity [%] Average oxide thickness [nm] St. deviation Non-uniformity [%] Average oxide thickness [nm] St. deviation Non-uniformity [%]
Run 1 28-01-2015 109.7 1.0 1.7 107.7 0.9 1.1 106.5 0.8 1.2 107.0 2.1 1.9
Run 2 28-01-2015 107.3 1.7 2.4 105.0 1.4 1.7 107.3 0.7 0.9 105.7 1.0 0.9
Run 3 30-01-2015 103.6 0.8 1.1 102.6 0.6 1.2 102.2 0.6 1.1 102.9 1.0 1.0
Average 106.9 1.2 1.7 105.1 1.0 1.3 105.3 0.7 1.1 105.2 1.4 1.3


Run-to-run
Average oxide thickness [nm] St. deviation Non-uniformity [%]
105.2 2.1 2.0


Refractive index

Date Wafer 4 Wafer 16 Wafer 28 Center point only
Average refractive index St. deviation Non-uniformity [%] Average refractive index St. deviation Non-uniformity [%] Average refractive index St. deviation Non-uniformity [%] Average refractive index St. deviation Non-uniformity [%]
Run 1 28-01-2015 1.46 0.00 0.04 1.46 0.00 0.07 1.46 0.00 0.06 1.4609 0.0004 0.0230
Run 2 28-01-2015 1.46 0.00 0.09 1.46 0.00 0.17 1.44 0.01 0.69 1.4561 0.0094 05873
Run 3 30-01-2015 1.46 0.00 0.06 1.46 0.00 0.05 1.46 0.00 0.07 1.4602 0.0004 0.0291
Average 1.46 0.00 0.06 1.46 0.00 0.10 1.46 0.00 0.27 1.46 0.00 0.21


Run-to-run
Average refractive index St. deviation Non-uniformity [%]
1.4591 0.0026 0.1637