Specific Process Knowledge/Thin film deposition/Deposition of TiW: Difference between revisions

Latest revision as of 14:04, 6 June 2023

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Sputtering of TiW

Deposition of TiW alloy can be done in the Wordentec. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).

	Sputter deposition (Wordentec)
General description	Sputter deposition of TiW
Pre-clean	RF Ar clean (not working at the moment (sept 2022))
Layer thickness	.
Deposition rate	Depending on process parameters, see here.
Batch size	24x2" wafers or 6x4" wafers or 6x6" wafers
Allowed substrates	Silicon wafers Quartz wafers Pyrex wafers
Allowed materials	Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar SU-8 Metals
Comments	TiW alloy: 10%/90% by weight

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-'''Feedback to this page''': '''[mailto:pvd@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW&action=edit click here]'''
+'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW click here]'''
+<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>
-Deposition of TiW alloy can take place in the Wordentec. '''Observe:''' ''right now we don´t have a TiW target for Wordentec, please contact thinfilm@danchip.dtu.dk if you are interested in depositing TiW.''
+==Sputtering of TiW==
+Deposition of TiW alloy can be done in the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).
+*[[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]]
+*[[Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers|Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec]]
@@ Line 12: / Line 17: @@
 ! Sputter deposition (Wordentec)
 |-style="background:WhiteSmoke; color:black"
+! General description
+| Sputter deposition of TiW
+|-
+|-style="background:LightGrey; color:black"
+! Pre-clean
+|RF Ar clean (not working at the moment (sept 2022))
+|-
+|-style="background:WhiteSmoke; color:black"
+! Layer thickness
+|.
+|-
+|-style="background:LightGrey; color:black"
+! Deposition rate
+|Depending on process parameters, see [[/Sputtering of TiW in Wordentec|here.]]
+|-
+|-style="background:WhiteSmoke; color:black"
 ! Batch size
 |
@@ Line 17: / Line 42: @@
 *6x4" wafers or
 *6x6" wafers
+|-
-|-style="background:LightGrey; color:black"
-! Pre-clean
-|RF Ar clean
-|-style="background:WhiteSmoke; color:black"
-! Layer thickness
-|.
 |-style="background:LightGrey; color:black"
 ! Allowed substrates
@@ Line 42: / Line 62: @@
 * SU-8
 * Metals
+|-
-|-style="background:LightGrey; color:black"
-! Deposition rate
+|-style="background:LightGrey;  color:black"
-|Depending on process parameters, see [[/Sputtering of TiW in Wordentec|here.]]
+! Comments
-|-
+| TiW alloy: 10%/90% by weight
 |}
-'''Deposited rates'''
-This is done by a sputtering process. Process parameters (argon pressure and effect) can be varied, the surface roughness and the deposition rate (see [[/Sputtering of TiW in Wordentec|here]]) and may change with these settings.
-'''Deposited film characteristics'''
-AFM pictures show how the surface roughness is dependent of the process parameters, this can be seen here.