Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions
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4th Level - Comparison
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<center><span style="background:#87CEEB">4th Level - Comparison</span></center> | |||
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Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment. | Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment. | ||
Revision as of 12:23, 20 February 2013
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Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.
| E-beam evaporation (Alcatel) | E-beam evaporation (Wordentec) | Sputter (Lesker) | |
|---|---|---|---|
| Batch size |
|
|
|
| Pre-clean | RF Ar clean | RF Ar clean | RF Ar clean |
| Layer thickness | 10 Å to 5000Å | 10 Å to 5000Å | 10 Å to |
| Deposition rate | 2 Å/s to 15 Å/s | 1 Å/s to 15 Å/s |
Adhesion of Au on Si
Studies of Au deposition processes
Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings