Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions

Revision as of 11:55, 21 November 2007

Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Alcatel)	E-beam evaporation (Leybold)	E-beam evaporation (Wordentec)	Sputter (Lesker)
Batch size	Up to 1x4" wafers smaller pieces	8x4" wafers or 5x6" wafers	24x2" wafers or 6x4" wafers or 6x6" wafers	up to 1x6" wafer
Pre-clean	RF Ar clean	Ar ion bombartment	RF Ar clean	RF Ar clean
Layer thickness	10Å to 1µm	10Å to 1500 Å	10Å to 1 µm	10Å to
Deposition rate	2Å/s to 15Å/s	1Å/s to 5Å/s	10Å/s to 15Å/s

Revision as of 11:40, 21 November 2007 (view source) 192.38.87.73 (talk) (New page: Titanium can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment. {\| border="1" cellspacing="0" cellpadding="4" ! ! E-beam evapora...)		Revision as of 11:55, 21 November 2007 (view source) 192.38.87.73 (talk) No edit summary Newer edit →
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	~~Titanium~~ can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.		Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.