Specific Process Knowledge/Characterization/Profiler: Difference between revisions

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==Dektak XTA_new stylus profiler==
==Dektak XTA_new stylus profiler==


The newer Dektak XTA stylus profiler is usable for profiling surfaces of samples with structures in the micrometer range.
A profil measurement can be done in a specific point by using a high magnification camera to locate the structure. It is also possible to program the stylus to measure in several positions, defined with respect to some deskew points. Stress measurements of thin films can be done by measuring the wafer bow.


==Comparing the profilers==
==Comparing the profilers==
Take a look at the [[Specific Process Knowledge/Characterization/Topographic measurement|topographic measurement]] page.
Take a look at the [[Specific Process Knowledge/Characterization/Topographic measurement|topographic measurement]] page.

Revision as of 15:01, 3 October 2012

Dektak 8 stylus profiler

Dektak8: positioned in Hymite room (characterization room).

Dektak 8 stylus profiler is a product of Veeco Instruments. It is usable for profiling surfaces of samples with structures in the micrometer range. It can measure in a specific point found with help from high magnification video cameras or it can be programmed to measure several points defined with respect to some deskew points. It can also be used for stress measurements of thin films by measuring the wafer bow.

To get some product information and some tips and tricks from the vendor take a look at Veeco's homepage [1]

A rough overview of the performance of Dektak 8 stylus profiler

Purpose Profiler for measuring micro structures.
  • Single point profiles
  • Wafer mapping
  • Stress measurements by measuring wafer bow
  • Surface roughness on a line scan
Performance Scan range xy

Line scan x: 50 µm to 100 mm

Scan range z

50 Å to 1 mm

Resolution xy

down to 0.067 µm

Resolution z

1Å, 10Å, 40Å or 160Å (for ranges 65kÅ, 655 kÅ, 2620 kÅ and 1mm respectively)

Max. scan depth as a function of trench width W

1.2(W[µm]-5µm)

Hardware settings Tip radius
  • 5 µm 45o cone
Substrates Substrate size
  • up to 8"
Substrate material allowed
  • In principle all materials

Optical Profiler (Sensofar)

Optical Profiler (Sensofar): positioned in Hymite room (next to the Dektak profilers)


PLu Neox 3D Optical Profiler (from Sensofar) has a dual-technology sensor head that combines confocal and interferometry techniques as well as thick and thin film measurement capabilities.

The Neox sensor head provides standard microscope imaging, confocal imaging, confocal profiling, PSI (Phase Shift Interferometry), VSI (Vertical Scanning Interferometry) and high resolution thin film thickness measurement on a single instrument.

The main purpose is 3D topographic imaging of surfaces, step height measurements in smaller trenches/holes than can be obtained with standard stylus methods, roughness measurements with larger FOV (Field Of View) than the AFM, but less horisontal resolution.


Process examples


A rough overview of the performance of the Optical Profiler (Sensofar)

Purpose 3D topographic imaging of surfaces.
  • 3D imaging of surfaces
  • Roughness measurements
  • Step height measurements
  • 3D topographic measurements
  • Thick and thin film thickness measurements in small spots (down to 4µm)
Posibilities Confocal and interferometric profiling and reflectometry
  • standard microscope imaging
  • confocal imaging
  • confocal profiling
  • PSI (Phase Shift Interferometry)
  • VSI (Vertical Scanning Interferometry)
  • high resolution thin film thickness measurement using reflectrometry
  • wafer mapping
Performance Depending on the objective chosen
  • see the performance of the different objectives here:
    Optical Profiler Table 2.jpg
Substrates Substrate size
  • up to more than 6"
Substrate material allowed
  • In principle all materials


Dektak XTA_new stylus profiler

The newer Dektak XTA stylus profiler is usable for profiling surfaces of samples with structures in the micrometer range. A profil measurement can be done in a specific point by using a high magnification camera to locate the structure. It is also possible to program the stylus to measure in several positions, defined with respect to some deskew points. Stress measurements of thin films can be done by measuring the wafer bow.

Comparing the profilers

Take a look at the topographic measurement page.