Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions

Latest revision as of 15:02, 30 January 2025

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Machine decommissioned end of 2024

Machine decommissioned end of 2024

The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.

The user manual, user APV, technical information and contact information can be found in LabManager:

Equipment		Polisher/Lapper
Purpose	Thinning of substrates of	InP GaAs Silicon Metals Glass/Quartz
Performance	Thinning	Removal rate: 1-10µm/min Thickness accuracy: +/- 10 µm Thickness homogeneity: +/- 10 µm Roughness: +/- ? µm
Performance	Polishing	Removal rate: ~1 µm/min Thickness accuracy: ? µm Thickness homogeneity: ? µm Roughness: +/- ? µm
Process parameter range	Polishing liquid	Al2O3 (alumina) powder: 3, 9 or 20 µm Chemlox (for polishing) SF1 Polishing Fluid (for polishing e.g. SiO2)
	Polishing cloths	Chemcloth Polishing Cloths (for use with SF1 liquid)
	Rotation speed	Thinning: 5-20 rpm Polishing: 5-80 rpm
	Arm sweep	Thinning: stationary Polishing: 12% (inner) - 80% (outer)
Substrates	Batch size	# small samples one 50 mm wafer one 100 mm wafer
	Allowed materials	InP GaAs Silicon Metals Glass/Quartz

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+<big>''' Machine decommissioned end of 2024 '''
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 == Polisher/Lapper ==
+<big>''' Machine decommissioned end of 2024 '''
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 ==Equipment performance and process related parameters==
-[[File:IMG_20230228_113121.jpg|thumb|400px|PM5 lapper in Fume hood]]
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 [[File:IMG_20230228_113134.jpg|thumb|left|300px|lapping jig]]
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+[[File:IMG_20230228_113127.jpg|thumb|1000px|mounting/measuring space]]
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