Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions

Latest revision as of 15:02, 30 January 2025

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Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

All links Labmanager requires login.

Machine decommissioned end of 2024

Machine decommissioned end of 2024

The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.

The user manual, user APV, technical information and contact information can be found in LabManager:

Equipment		Polisher/Lapper
Purpose	Thinning of substrates of	InP GaAs Silicon Metals Glass/Quartz
Performance	Thinning	Removal rate: 1-10µm/min Thickness accuracy: +/- 10 µm Thickness homogeneity: +/- 10 µm Roughness: +/- ? µm
Performance	Polishing	Removal rate: ~1 µm/min Thickness accuracy: ? µm Thickness homogeneity: ? µm Roughness: +/- ? µm
Process parameter range	Polishing liquid	Al2O3 (alumina) powder: 3, 9 or 20 µm Chemlox (for polishing) SF1 Polishing Fluid (for polishing e.g. SiO2)
	Polishing cloths	Chemcloth Polishing Cloths (for use with SF1 liquid)
	Rotation speed	Thinning: 5-20 rpm Polishing: 5-80 rpm
	Arm sweep	Thinning: stationary Polishing: 12% (inner) - 80% (outer)
Substrates	Batch size	# small samples one 50 mm wafer one 100 mm wafer
	Allowed materials	InP GaAs Silicon Metals Glass/Quartz

@@ Line 2: / Line 2: @@
 <!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page-->
+'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
+'''All links Labmanager requires login.'''
+<big>''' Machine decommissioned end of 2024 '''
+</big>
 == Polisher/Lapper ==
-[[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]]
+<big>''' Machine decommissioned end of 2024 '''
+</big>
-The Logitech Orbis Polisher (CMP) is for polishing wafers (removing material in the nm range) it is not for thinning down wafers or other substrates.
+<!-- copyright issue rkc -->
+<!-- copyright issue rkc [[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]]
+Training is required before using th machine. The machine is equipped with a LabManager lock.-->
+The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.
 '''The user manual, user APV, technical information and contact information can be found in LabManager:'''
@@ Line 17: / Line 27: @@
 ==Equipment performance and process related parameters==
+[[File:IMG_20230228_113121.jpg|thumb|350px|PM5 lapper in Fume hood]]
 {| border="2" cellspacing="0" cellpadding="2"
@@ Line 103: / Line 114: @@
 *Allowed material 3 -->
 |-
 |}
+[[File:IMG_20230228_113134.jpg|thumb|left|300px|lapping jig]]
+[[File:IMG_20230228_113127.jpg|thumb|1000px|mounting/measuring space]]
 <br clear="all" />