Specific Process Knowledge/Wafer and sample drying: Difference between revisions

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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_and_sample_drying click here]'''  
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_and_sample_drying click here]'''  


'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
=Drying Comparison Table=
=Drying Comparison Table=


{| border="2" cellspacing="0" cellpadding="2"  
{| border="2" cellspacing="0" cellpadding="2"  


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
|-style="background:lightgray; color:black"
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 1</b>
!Equipment  
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 2</b>
 
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 3</b>
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryer 2|Spin dryer 2]]
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 4</b>
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryer 3|Spin dryer 3]]
|style="background:WhiteSmoke; color:black"|<b>Critical point dryer</b>
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryer 5|Spin dryer 5]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Spin dryer 6|Spin dryer 6]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying/Critical Point Dryer|Critical point dryer]]
|[[Specific_Process_Knowledge/Wafer_and_sample_drying #Nitrogen guns|N<sub>2</sub> guns]]
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Location
 
|style="background:LightGrey; color:black"|
|-style="background:WhiteSmoke; color:black"
|style="background:WhiteSmoke; color:black"|
!Location
*C-1
|
|style="background:WhiteSmoke; color:black"|
*B-1
*B-1
|style="background:WhiteSmoke; color:black"|
|
*D-4
*D-3
|style="background:WhiteSmoke; color:black"|
|
*E-5
*D-3
|style="background:WhiteSmoke; color:black"|
|
*D-4
*F-3
|
*D-3
|
*In fumehoods and at chemical benches
|-
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose  
 
|style="background:LightGrey; color:black"|
|-style="background:lightgray; color:black"
|style="background:WhiteSmoke; color:black"|
!Purpose  
|
*Drying 
|
*Drying
*Drying
|style="background:WhiteSmoke; color:black"|
|
*Drying
*Drying
|style="background:WhiteSmoke; color:black"|
|
*Drying
|style="background:WhiteSmoke; color:black"|
*Drying
*Drying
*Rinsing + drying
*Rinsing + drying
|style="background:WhiteSmoke; color:black"|
|
*Drying sensitive samples. E.g. with cantilevers
*Drying sensitive samples. E.g. with cantilevers
|
*Drying all kind of samples.
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
 
|style="background:LightGrey; color:black"|Batch size
|-style="background:WhiteSmoke; color:black"
|style="background:WhiteSmoke; color:black"|
!Batch size
*<nowiki>#</nowiki> 100 mm wafers
|
|style="background:WhiteSmoke; color:black"|
*100 mm wafers: 1-25
*<nowiki>#</nowiki> 100 mm wafers
*150 mm wafers: 1-25
|style="background:WhiteSmoke; color:black"|
|
*<nowiki>#</nowiki> 100 mm wafers
*100 mm wafers: 1-25
*<nowiki>#</nowiki> 150 mm wafers
*150 mm wafers: 1-25
|style="background:WhiteSmoke; color:black"|
|
*<nowiki>#</nowiki> 50 mm wafers
*100 mm wafers: 1-25
*<nowiki>#</nowiki> 100 mm wafers
*150 mm wafers: 1-25
*<nowiki>#</nowiki> 150 mm wafers  
|
|style="background:WhiteSmoke; color:black"|
*100 mm wafers: 1-25
*150 mm wafers: 1-25
*200 mm wafers: 1-25
|
*1 to 5 wafers per run. Sizes: 2”, 4" or 6"
*1 to 5 wafers per run. Sizes: 2”, 4" or 6"
* Pieces (up to 10x10mm)
* Pieces (up to 10x10mm)
|
*One sample at a time
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
 
|style="background:WhiteSmoke; color:black"|
|-style="background:lightgray; color:black"
!Allowed materials
|
*Only for RCA cleaned wafers
|
*No restrictions
*No restrictions
|style="background:WhiteSmoke; color:black"|
|
*Only for RCA cleaned wafers
|style="background:WhiteSmoke; color:black"|
*No restrictions
*No restrictions
|style="background:WhiteSmoke; color:black"|
|
*No restrictions
*No restrictions
|style="background:WhiteSmoke; color:black"|
|
*Si,SiO2, Si3N4
*Si,SiO2, Si3N4
*Quartz and Pyrex
*Quartz and Pyrex
*InAlP, GaAs
*InAlP, GaAs
*SU8
*SU8
|
*No restriction
|-  
|-  
|}
|}


= Spin dryers =
A tool used for drying wafers.
A single cassette of wafers is placed in a stainless steel rotor. The wafers are centered just off the axis of rotation, and rotated at high RPM so that centrifugal force “locks” the wafers in place.
Some of the tools have DI water connected, and can be used for both rinsing and drying of wafers, while other tools do not and can only be used for drying.
All wafers have to be washed in a wetbench cleaning station before going into the spin dryer, regardless of using the rinse function or not.




== Choose a drying equipment ==
'''The user manual, technical information, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=157 Spin dryer 2] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=158 Spin dryer 3]  [https://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=408 Spin dryer 5] [https://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=323 Spin dryer 6 (8")]'''


*[[/Critical Point Dryer|Critical Point Dryer]]
*[[/Spin Dryers|Spin Dryers]]


== Process information ==
== Process information ==


Standard process is 120 seconds for 100mm wafers or 180 seconds for 150mm wafers, at 2000 RPM - drying only.
Standard process is:
#Rinse (with DI water) for 60 seconds at 500 RPM
#Dry with nitrogen for 150 seconds at 1800 RPM
#Dry with nitrogen and anti-static purge for 30 seconds at 1800 RPM
 
All spin dryers use the following carriers:
*100 mm wafers: A72-40MB
*150 mm wafers: A182-60MB
*200 mm wafers: A192-80M
 
<span style="color:red">It is not allowed to use other carriers in the spin dryers, as this may damage the motor due to incorrect mass distribution. It may also cause fragile wafers to break due to excessive vibrations caused by the mass imbalance.</span>
 
== Spin dryer 2 ==
 
[[File:spinDryer_2.jpg|640px|thumb|right]]
 
Spin dryer 2 is for RCA processing only, and is located in B-1 next to the RCA bench.
*Top chamber: 100 mm wafers
*Bottom chamber: 150 mm wafers
 
<br clear="all" />
 
== Spin dryer 3 ==
 
[[File:spinDryer_3.jpg|640px|thumb|right]]
 
Spin dryer 3 is located in D-3 between the working table and wet bench 03.
*Top chamber: 100 mm wafers
*Bottom chamber: 150 mm wafers
 
<br clear="all" />
 
== Spin dryer 5 ==
 
[[File:spinDryer_4.jpg|640px|thumb|right]]
 
Spin dryer 5 is located in D-3 between the HF vapor phase etcher and wet bench 07.
*Top chamber: 100 mm wafers
*Bottom chamber: 150 mm wafers
 
<br clear="all" />
 
== Spin dryer 6 ==
 
[[File:spinDryer_5.jpg|640px|thumb|right]]
 
Spin dryer 6 is located in F-3 Next to the Developer: TMAH stepper. It has a single process chamber that is capable of processing 100 mm, 150 mm and 200 mm wafers. The wafer size is easily changed, by changing the rotor insert frame.
 
<br clear="all" /><br clear="all" />


''If'' rinsing is used as well, the standard process is 60 seconds of rinse at 500 RPM, followed by 120/180 seconds of drying at 2000 RPM.
= Nitrogen guns =


Nitrogen guns are valuable for drying small substrate pieces or samples that otherwise cannot go into the outer drying tools.


<br clear="all" />
<br clear="all" />

Latest revision as of 08:45, 20 November 2024

Feedback to this page: click here

Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

Drying Comparison Table

Equipment Spin dryer 2 Spin dryer 3 Spin dryer 5 Spin dryer 6 Critical point dryer N2 guns
Location
  • B-1
  • D-3
  • D-3
  • F-3
  • D-3
  • In fumehoods and at chemical benches
Purpose
  • Drying
  • Drying
  • Drying
  • Drying
  • Rinsing + drying
  • Drying sensitive samples. E.g. with cantilevers
  • Drying all kind of samples.
Batch size
  • 100 mm wafers: 1-25
  • 150 mm wafers: 1-25
  • 100 mm wafers: 1-25
  • 150 mm wafers: 1-25
  • 100 mm wafers: 1-25
  • 150 mm wafers: 1-25
  • 100 mm wafers: 1-25
  • 150 mm wafers: 1-25
  • 200 mm wafers: 1-25
  • 1 to 5 wafers per run. Sizes: 2”, 4" or 6"
  • Pieces (up to 10x10mm)
  • One sample at a time
Allowed materials
  • Only for RCA cleaned wafers
  • No restrictions
  • No restrictions
  • No restrictions
  • Si,SiO2, Si3N4
  • Quartz and Pyrex
  • InAlP, GaAs
  • SU8
  • No restriction

Spin dryers

A tool used for drying wafers. A single cassette of wafers is placed in a stainless steel rotor. The wafers are centered just off the axis of rotation, and rotated at high RPM so that centrifugal force “locks” the wafers in place.

Some of the tools have DI water connected, and can be used for both rinsing and drying of wafers, while other tools do not and can only be used for drying. All wafers have to be washed in a wetbench cleaning station before going into the spin dryer, regardless of using the rinse function or not.


The user manual, technical information, and contact information can be found in LabManager: Spin dryer 2 Spin dryer 3 Spin dryer 5 Spin dryer 6 (8")


Process information

Standard process is:

  1. Rinse (with DI water) for 60 seconds at 500 RPM
  2. Dry with nitrogen for 150 seconds at 1800 RPM
  3. Dry with nitrogen and anti-static purge for 30 seconds at 1800 RPM

All spin dryers use the following carriers:

  • 100 mm wafers: A72-40MB
  • 150 mm wafers: A182-60MB
  • 200 mm wafers: A192-80M

It is not allowed to use other carriers in the spin dryers, as this may damage the motor due to incorrect mass distribution. It may also cause fragile wafers to break due to excessive vibrations caused by the mass imbalance.

Spin dryer 2

Spin dryer 2 is for RCA processing only, and is located in B-1 next to the RCA bench.

  • Top chamber: 100 mm wafers
  • Bottom chamber: 150 mm wafers


Spin dryer 3

Spin dryer 3 is located in D-3 between the working table and wet bench 03.

  • Top chamber: 100 mm wafers
  • Bottom chamber: 150 mm wafers


Spin dryer 5

Spin dryer 5 is located in D-3 between the HF vapor phase etcher and wet bench 07.

  • Top chamber: 100 mm wafers
  • Bottom chamber: 150 mm wafers


Spin dryer 6

Spin dryer 6 is located in F-3 Next to the Developer: TMAH stepper. It has a single process chamber that is capable of processing 100 mm, 150 mm and 200 mm wafers. The wafer size is easily changed, by changing the rotor insert frame.



Nitrogen guns

Nitrogen guns are valuable for drying small substrate pieces or samples that otherwise cannot go into the outer drying tools.


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