LabAdviser/Process flow approval: Difference between revisions
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== Process Flow Approval == | == Process Flow Approval == | ||
=== Why do process flows need to be reviewed === | === Why do process flows need to be reviewed === | ||
Before implementing process flows in the DTU | Before implementing new process flows in the DTU Nanolab cleanroom facilities, it is recommended to have the process approved by Nanolab personnel. This is done to ensure safety to all cleanroom users and to guard involved machinery and equipment during the process, e.g. for cross-contamination, as well as to support your work in the cleanroom. | ||
Process flows or any questions regarding process flow review should be submitted to '''[mailto: | Process flows or any questions regarding process flow review should be submitted to '''[mailto:nanolabsupport@nanolab.dtu.dk?subject=⟨user%20name⟩:%20process%20flow nanolabsupport@nanolab.dtu.dk]'''. Please add your Name to the subject line. | ||
=== Recommendations to the setup of the process flow === | === Recommendations to the setup of the process flow === | ||
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* '''Process flow: ''' Mark each page of the process flow with title, author, affiliation name, batch number and page number. | * '''Process flow: ''' Mark each page of the process flow with title, author, affiliation name, batch number and page number. | ||
* '''Illustrations:''' Supply key process steps with illustrations of top layout and layer layout. If possible, mark the steps that carry a high risk of yield loss. | * '''Illustrations:''' Supply key process steps with illustrations of top layout and layer layout. If possible, mark the steps that carry a high risk of yield loss. | ||
* ''' | * '''Substrates:''' Specify the size, type and number of wafers to process and whether wafers should be processed differently. | ||
* '''Photolithography:''' Specify the mask-name used for each photolithography step, and whether alignment should be performed to specific alignment marks. Specify aligner | * '''Photolithography:''' Specify the mask-name (or -layers) used for each photolithography step, and whether alignment should be performed to specific alignment marks. Specify aligner equipment, exposure dose, type of process (hard contact/soft contact), and the name of developer. | ||
* '''Metal evaporation:''' Specify name of evaporator | * '''Metal evaporation:''' Specify name of evaporator equipment, process name, metal thicknesses and tolerances. | ||
* '''Wet/dry etch:''' | * '''Wet/dry etch:''' Specify name of etching equipment, process name, etch parameters, etch depth and tolerances. | ||
* '''Chemicals:''' | * '''Chemicals:''' If the process includes wet steps carried out in beakers, it should be specified how to dispose used chemicals. | ||
=== Process Flow Template === | === Process Flow Template === | ||
You can download a template for process-flows here (word format): | You can download a template for process-flows here (word format): | ||
[[media: | [[media:Process_flow_template_v3.1.docx|Process_flow_template_v3.1.docx]]. | ||
Another possibility is to use the Flow editor in LabManager. | Another possibility is to use the Flow editor in LabManager. | ||
Latest revision as of 08:42, 13 May 2024
Feedback to this page: Click here
Process Flow Approval
Why do process flows need to be reviewed
Before implementing new process flows in the DTU Nanolab cleanroom facilities, it is recommended to have the process approved by Nanolab personnel. This is done to ensure safety to all cleanroom users and to guard involved machinery and equipment during the process, e.g. for cross-contamination, as well as to support your work in the cleanroom.
Process flows or any questions regarding process flow review should be submitted to nanolabsupport@nanolab.dtu.dk. Please add your Name to the subject line.
Recommendations to the setup of the process flow
- Process flow: Mark each page of the process flow with title, author, affiliation name, batch number and page number.
- Illustrations: Supply key process steps with illustrations of top layout and layer layout. If possible, mark the steps that carry a high risk of yield loss.
- Substrates: Specify the size, type and number of wafers to process and whether wafers should be processed differently.
- Photolithography: Specify the mask-name (or -layers) used for each photolithography step, and whether alignment should be performed to specific alignment marks. Specify aligner equipment, exposure dose, type of process (hard contact/soft contact), and the name of developer.
- Metal evaporation: Specify name of evaporator equipment, process name, metal thicknesses and tolerances.
- Wet/dry etch: Specify name of etching equipment, process name, etch parameters, etch depth and tolerances.
- Chemicals: If the process includes wet steps carried out in beakers, it should be specified how to dispose used chemicals.
Process Flow Template
You can download a template for process-flows here (word format): Process_flow_template_v3.1.docx.
Another possibility is to use the Flow editor in LabManager. Link: LabManager Flow editor or find the link in LabManager menu under "Equipment".
Note! this is still under development. Feedback is welcome.
Cross Contamination
Cross Contamination presentation from meetings aug/sept 2014.