Specific Process Knowledge/Lithography/Coaters/labspin: Difference between revisions

Latest revision as of 10:52, 7 February 2024

Spin coater: Labspin



Spin Coater: Labspin 02	Spin Coater: Labspin 03 + fumehood 11
Loacted in wetbench 08 in E-5	Located in wetbench 09 in E-5
LabSpin 6, Süss MicroTec	LabSpin 6, Süss MicroTec

Training video: LabSpin02 + 03

Process information

Spin curves (LabSpin 6):

More information on resists (incl. spin curves) is available in the resist overview.

Available bowlsets:

Bowlset name	Component solvent	Cleaning solvent	List of resists	Comments
AZ resist	PGMEA/Ethyl Lactate	Acetone	AZ 5214E AZ 4562 AZ MiR 701 AZ nLOF 2000 series mr-I8100R	Two bowlsets available
CSAR/ZEP/mrEBL/PMMA	Anisole	Remover 1165	AR-P 6200 series (CSAR 62) ZEP520A mr EBL 6000 PMMA (in anisole) UV5 mr-T85L XNIL26 mri8000 mr-I 7010E mr-XNIL26_SF mrNIL210
HSQ/AR-N 8200	MIBK/PGMEA	Acetone	HSQ (FOx series) AR-N 8200
OrmoComp/OrmoStamp	Propyl Acetate	Acetone	OrmoComp OrmoStamp OrmoPrime OrmoClad Inkron mr-I-7030R mr-I 8020E mr-I-7010E mrNIL210 mr-I 8500E mr-T85 MRT HI01XP Protek B3 mrUVCur21 mr-I 8100E_XP mrNIL210 MRT HI01XP mr-NIL 6000.3E mr-I 8100R_XP
BCB/CYCLOTENE	Mesitylene	T1100	3022-X 4022-X
Epoxy/Acrylate	Cyclopentanone/PGMEA	Acetone	SU-8 2000 series mr-DWL LOR (1A, 3A, 5A) mr-i 8030e mr-NIL200 DELO-PRE/OM4310 OrmoStamp Inkron mr-I 8020E OM4310
AR-P 617/AR-N 7520	PGME/PGMEA	Acetone	AR-N 7500 series
Polymer Ps-b-PDMS/block copolymer	Heptane	Ethyl Acetate
DIRTY bowlset	Anything Organic	Use the appropriate cleaning reagent for your resist

Equipment performance and process related parameters

Purpose	Labspin	Spin coating of resist ONLY in dedicated bowlsets Please do NOT use substances which is not for the dedicated bowlsets
Purpose	All purpose	Spin coating of dirty substances in All purpose
Process parameters	Spin speed	Vacuum chuck: 100 - 8000 rpm Edge handling chuck: Max. 3000 rpm
Process parameters	Spin acceleration	200 - 4000 rpm/s
Substrates	Substrate size	Chips 5x5 mm and up 50 mm wafers 100 mm wafers 150 mm wafers
	Allowed materials	All cleanroom materials Please ONLY use substances which is for the dedicated bowlsets in labspins
	Batch	1

@@ Line 49: / Line 49: @@
 |-
 |-style="background:silver; color:black"
-|
+!Bowlset name
 !Component solvent
 !Cleaning solvent
@@ Line 61: / Line 61: @@
 |PGMEA/Ethyl Lactate
 |Acetone
-|AZ 5214E, AZ 4562, AZ MiR 701, AZ nLOF 2000 series,
+|
-mr-I8100R?
+AZ 5214E<br>
-|Two sets available
+AZ 4562<br>
+AZ MiR 701<br>
+AZ nLOF 2000 series<br>
+mr-I8100R
+|Two bowlsets available
 |-
@@ Line 71: / Line 75: @@
 |Anisole
 |Remover 1165
-|AR-P 6200 series (CSAR 62), ZEP520A, mr EBL 6000, PMMA (in anisole),
+|
-UV5?, mr-T85L?, XNIL26?, mri8000?, mr-I 7010E?, mr-XNIL26_SF?, mrNIL210?
+AR-P 6200 series (CSAR 62)<br>
+ZEP520A<br>
+mr EBL 6000<br>
+PMMA (in anisole)<br>
+UV5<br>
+mr-T85L<br>
+XNIL26<br>
+mri8000<br>
+mr-I 7010E<br>
+mr-XNIL26_SF<br>
+mrNIL210
 |
 |-
@@ Line 81: / Line 95: @@
 |MIBK/PGMEA
 |Acetone
-|HSQ (FOx series), AR-N 8200
+|
+HSQ (FOx series)<br>
+AR-N 8200
 |
 |-
@@ Line 90: / Line 106: @@
 |Propyl Acetate
 |Acetone
-|OrmoComp, OrmoStamp, OrmoPrime, OrmoClad?
+|
-Inkron?, mr-I-7030R?, mr-I 8020E?, mr-I-7010E?, mrNIL210?, mr-I 8500E?, mr-T85?, MRT HI01XP?, Protek B3?, mrUVCur21?, mr-I 8100E_XP?, mrNIL210?, MRT HI01XP?, mr-NIL 6000.3E?, mr-I 8100R_XP?
+OrmoComp<br>
+OrmoStamp<br>
+OrmoPrime<br>
+OrmoClad<br>
+Inkron<br>
+mr-I-7030R<br>
+mr-I 8020E<br>
+mr-I-7010E<br>
+mrNIL210<br>
+mr-I 8500E<br>
+mr-T85<br>
+MRT HI01XP<br>
+Protek B3<br>
+mrUVCur21<br>
+mr-I 8100E_XP<br>
+mrNIL210<br>
+MRT HI01XP<br>
+mr-NIL 6000.3E<br>
+mr-I 8100R_XP
 |
 |-
@@ Line 100: / Line 134: @@
 |Mesitylene
 |T1100
-|3022-X, 4022-X
+|
+-X<br>
+-X
 |
 |-
@@ Line 109: / Line 145: @@
 |Cyclopentanone/PGMEA
 |Acetone
-|SU-8 2000 series, mr-DWL, LOR (1A, 3A, 5A)
+|
-mr-i 8030e?, mr-NIL200?, DELO-PRE/OM4310?, OrmoStamp?, Inkron?, mr-I 8020E?, OM4310?
+SU-8 2000 series<br>
+mr-DWL<br>
+LOR (1A, 3A, 5A)<br>
+mr-i 8030e<br>
+mr-NIL200<br>
+DELO-PRE/OM4310<br>
+OrmoStamp<br>
+Inkron<br>
+mr-I 8020E<br>
+OM4310
 |
 |-
@@ Line 151: / Line 196: @@
 !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Purpose
 |style="background:LightGrey; color:black"|Labspin
-|style="background:WhiteSmoke; color:black" align="center"|
+|style="background:WhiteSmoke; color:black"|
 Spin coating of resist ONLY in dedicated bowlsets
@@ Line 157: / Line 202: @@
 |-
 |style="background:LightGrey; color:black"|All purpose
-|style="background:WhiteSmoke; color:black" align="center"|
+|style="background:WhiteSmoke; color:black"|
 Spin coating of dirty substances in '''All purpose'''
 <br>
@@ Line 164: / Line 209: @@
 !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
 |style="background:LightGrey; color:black"|Spin speed
-|style="background:WhiteSmoke; color:black" align="center"|
+|style="background:WhiteSmoke; color:black"|
-*Vacuum chuck: 100 - 5000 rpm <br>
+*Vacuum chuck: 100 - 8000 rpm <br>
 *Edge handling chuck: Max. 3000 rpm
 |-
 |style="background:LightGrey; color:black"|Spin acceleration
-|style="background:WhiteSmoke; color:black" align="center"|
+|style="background:WhiteSmoke; color:black"|
 *200 - 4000 rpm/s <br>
@@ Line 175: / Line 220: @@
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
 |style="background:LightGrey; color:black" |Substrate size
-|style="background:WhiteSmoke; color:black" align="center"|
+|style="background:WhiteSmoke; color:black"|
 *Chips 5x5 mm and up
 *50 mm wafers
@@ Line 183: / Line 228: @@
 |-
 | style="background:LightGrey; color:black"|Allowed materials
-|style="background:WhiteSmoke; color:black" align="center"|
+|style="background:WhiteSmoke; color:black"|
 All cleanroom materials
@@ Line 190: / Line 235: @@
 |-
 |style="background:LightGrey; color:black"|Batch
-|style="background:WhiteSmoke; color:black" align="center"|
+|style="background:WhiteSmoke; color:black"|
 |-