Specific Process Knowledge/Lithography/Coaters/labspin: Difference between revisions

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Created page with "== Manual Spin Coaters == {| cellpadding="2" style="border: 2px solid darkgray;" align="right" ! width="350" | ! width="350" | ! width="350" | |- border="0" align="center" |300px |300px |300px |- align="center" | '''Spin Coater: Labspin 02''' || '''Spin Coater: Labspin 03 + fumehood 11''' || '''Spin Coater: Manual All Purpose (Decommissioned)''' |- align="center" | Loacted in w..."
 
Jehem (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, danchip
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== Manual Spin Coaters ==
==Spin coater: Labspin==


{| cellpadding="2" style="border: 2px solid darkgray;" align="right"
{| cellpadding="2" style="border: 0px solid darkgray;" align="right"
! width="350" |
! width="350" |
! width="350" |  
! width="350" |  
! width="350" | 


|- border="0" align="center"
|- border="0" align="center"
|[[Image:Labspin_2.JPG|300px]]
|[[Image:Labspin_2.JPG|300px]]
|[[Image:Labspin_3_+_fumehood_11.JPG|300px]]
|[[Image:Labspin_3_+_fumehood_11.JPG|300px]]
|[[Image:IMG 1175.JPG|300px]]


|- align="center"
|- align="center"
| '''Spin Coater: Labspin 02''' ||  '''Spin Coater: Labspin 03 + fumehood 11''' || '''Spin Coater: Manual All Purpose (Decommissioned)'''
|'''Spin Coater: Labspin 02'''
|'''Spin Coater: Labspin 03 + fumehood 11'''


|- align="center"
|- align="center"
| Loacted in wetbench 08 in E-5 ||  Located in wetbench 09 in E-5|| Located in fumehood in C-1
|Loacted in wetbench 08 in E-5
|Located in wetbench 09 in E-5


|- align="center"
|- align="center"
| LabSpin 6, Süss MicroTec || LabSpin 6, Süss MicroTec || WS-650, Laurell
|LabSpin 6, Süss MicroTec
|LabSpin 6, Süss MicroTec


|- align="center"
|- align="center"
| '''[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=362 LabManager]''' || '''[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=387 LabManager]''' || '''[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=315 LabManager]'''
|'''[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=362 LabManager]'''|
|'''[http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=387 LabManager]'''|


|}
|}
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===Process information===
===Process information===


Spin curves (LabSpin 6): [[media:AZ5214E_spin_curve.pdf‎|AZ 5214E‎]], [[media:Spin_curve_nLoF2020.pdf‎|AZ nLOF 2020]], [[media:Spin_curve_ZEP520A.pdf‎|ZEP 520A‎]], [[media:Spin_curve_Fox-15.pdf|FOX-15]], [[media:AZ_4562_spin_curve.pdf|AZ 4562‎]], [[Specific_Process_Knowledge/Lithography/CSAR#Spin_Curves|CSAR 6200]], [[media:AZ MiR 701 spin curve.pdf|AZ MiR 701]].  
Spin curves (LabSpin 6):
*[[media:AZ5214E_spin_curve.pdf‎|AZ 5214E‎]]
*[[media:Spin_curve_nLoF2020.pdf‎|AZ nLOF 2020]]
*[[media:Spin_curve_ZEP520A.pdf‎|ZEP 520A‎]]
*[[media:Spin_curve_Fox-15.pdf|FOX-15]]
*[[media:AZ_4562_spin_curve.pdf|AZ 4562‎]]
*[[Specific_Process_Knowledge/Lithography/CSAR#Spin_Curves|CSAR 6200]]
*[[media:AZ MiR 701 spin curve.pdf|AZ MiR 701]].  


More information on resists (incl. spin curves) is available in the [[Specific_Process_Knowledge/Lithography/UVLithography#Resist_Overview|Resist Overview]].
More information on resists (incl. spin curves) is available in the [[Specific_Process_Knowledge/Lithography/Resist|resist overview]].
 
 
'''This table is under construction''' [[Image:section under construction.jpg|70px]]


'''Available bowlsets:'''
'''Available bowlsets:'''
{|border="1" cellspacing="1" cellpadding="7" style="text-align:center;"  
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"  
|-
|-


|-
|-
|-style="background:silver; color:black"
|-style="background:silver; color:black"
|
!Bowlset name
!Component solvent
!Component solvent
!Cleaning solvent
!Cleaning solvent
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|PGMEA/Ethyl Lactate
|PGMEA/Ethyl Lactate
|Acetone
|Acetone
|AZ 5214E, AZ 4562, AZ MiR 701, AZ nLOF 2000 series,
|
mr-I8100R?
AZ 5214E<br>
|Two sets available
AZ 4562<br>
AZ MiR 701<br>
AZ nLOF 2000 series<br>
mr-I8100R
|Two bowlsets available
|-
|-


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|Anisole
|Anisole
|Remover 1165
|Remover 1165
|AR-P 6200 series (CSAR 62), ZEP520A, mr EBL 6000, PMMA (in anisole),
|
UV5?, mr-T85L?, XNIL26?, mri8000?, mr-I 7010E?, mr-XNIL26_SF?, mrNIL210?
AR-P 6200 series (CSAR 62)<br>
ZEP520A<br>
mr EBL 6000<br>
PMMA (in anisole)<br>
UV5<br>
mr-T85L<br>
XNIL26<br>
mri8000<br>
mr-I 7010E<br>
mr-XNIL26_SF<br>
mrNIL210
|
|
|-
|-
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|MIBK/PGMEA
|MIBK/PGMEA
|Acetone
|Acetone
|HSQ (FOx series), AR-N 8200
|
HSQ (FOx series)<br>
AR-N 8200
|
|
|-
|-
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|Propyl Acetate
|Propyl Acetate
|Acetone
|Acetone
|OrmoComp, OrmoStamp, OrmoPrime, OrmoClad?
|
Inkron?, mr-I-7030R?, mr-I 8020E?, mr-I-7010E?, mrNIL210?, mr-I 8500E?, mr-T85?, MRT HI01XP?, Protek B3?, mrUVCur21?, mr-I 8100E_XP?, mrNIL210?, MRT HI01XP?, mr-NIL 6000.3E?, mr-I 8100R_XP?
OrmoComp<br>
OrmoStamp<br>
OrmoPrime<br>
OrmoClad<br>
Inkron<br>
mr-I-7030R<br>
mr-I 8020E<br>
mr-I-7010E<br>
mrNIL210<br>
mr-I 8500E<br>
mr-T85<br>
MRT HI01XP<br>
Protek B3<br>
mrUVCur21<br>
mr-I 8100E_XP<br>
mrNIL210<br>
MRT HI01XP<br>
mr-NIL 6000.3E<br>
mr-I 8100R_XP
|
|
|-
|-
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|Mesitylene
|Mesitylene
|T1100
|T1100
|3022-X, 4022-X
|
3022-X<br>
4022-X
|
|
|-
|-
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|Cyclopentanone/PGMEA
|Cyclopentanone/PGMEA
|Acetone
|Acetone
|SU-8 2000 series, mr-DWL, LOR (1A, 3A, 5A)
|
mr-i 8030e?, mr-NIL200?, DELO-PRE/OM4310?, OrmoStamp?, Inkron?, mr-I 8020E?, OM4310?
SU-8 2000 series<br>
mr-DWL<br>
LOR (1A, 3A, 5A)<br>
mr-i 8030e<br>
mr-NIL200<br>
DELO-PRE/OM4310<br>
OrmoStamp<br>
Inkron<br>
mr-I 8020E<br>
OM4310
|
|
|-
|-
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=== Equipment performance and process related parameters ===
=== Equipment performance and process related parameters ===


{| border="2" cellspacing="0" cellpadding="2"  
{|border="1" cellspacing="1" cellpadding="10" style="text-align:left;"  


|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Purpose
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Purpose
|style="background:LightGrey; color:black"|Labspin
|style="background:LightGrey; color:black"|Labspin
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
Spin coating of resist ONLY in dedicated bowlsets
Spin coating of resist ONLY in dedicated bowlsets


Line 153: Line 202:
|-
|-
|style="background:LightGrey; color:black"|All purpose
|style="background:LightGrey; color:black"|All purpose
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
Spin coating of dirty substances in '''All purpose'''
Spin coating of dirty substances in '''All purpose'''
<br>
<br>
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!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameters
|style="background:LightGrey; color:black"|Spin speed
|style="background:LightGrey; color:black"|Spin speed
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
*Vacuum chuck: 100 - 5000 rpm <br>
*Vacuum chuck: 100 - 8000 rpm <br>
*Edge handling chuck: Max. 3000 rpm
*Edge handling chuck: Max. 3000 rpm
|-
|-
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:LightGrey; color:black"|Spin acceleration
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
*200 - 4000 rpm/s <br>
*200 - 4000 rpm/s <br>


Line 171: Line 220:
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
|style="background:LightGrey; color:black" |Substrate size
|style="background:LightGrey; color:black" |Substrate size
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
*Chips 5x5 mm and up
*Chips 5x5 mm and up
*50 mm wafers
*50 mm wafers
Line 179: Line 228:
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
All cleanroom materials
All cleanroom materials


Line 186: Line 235:
|-
|-
|style="background:LightGrey; color:black"|Batch
|style="background:LightGrey; color:black"|Batch
|style="background:WhiteSmoke; color:black" align="center"|
|style="background:WhiteSmoke; color:black"|
1  
1  
|-  
|-  

Latest revision as of 10:52, 7 February 2024

Spin coater: Labspin

Spin Coater: Labspin 02 Spin Coater: Labspin 03 + fumehood 11
Loacted in wetbench 08 in E-5 Located in wetbench 09 in E-5
LabSpin 6, Süss MicroTec LabSpin 6, Süss MicroTec


Training video: LabSpin02 + 03

Process information

Spin curves (LabSpin 6):

More information on resists (incl. spin curves) is available in the resist overview.

Available bowlsets:

Bowlset name Component solvent Cleaning solvent List of resists Comments
AZ resist PGMEA/Ethyl Lactate Acetone

AZ 5214E
AZ 4562
AZ MiR 701
AZ nLOF 2000 series
mr-I8100R

Two bowlsets available
CSAR/ZEP/mrEBL/PMMA Anisole Remover 1165

AR-P 6200 series (CSAR 62)
ZEP520A
mr EBL 6000
PMMA (in anisole)
UV5
mr-T85L
XNIL26
mri8000
mr-I 7010E
mr-XNIL26_SF
mrNIL210

HSQ/AR-N 8200 MIBK/PGMEA Acetone

HSQ (FOx series)
AR-N 8200

OrmoComp/OrmoStamp Propyl Acetate Acetone

OrmoComp
OrmoStamp
OrmoPrime
OrmoClad
Inkron
mr-I-7030R
mr-I 8020E
mr-I-7010E
mrNIL210
mr-I 8500E
mr-T85
MRT HI01XP
Protek B3
mrUVCur21
mr-I 8100E_XP
mrNIL210
MRT HI01XP
mr-NIL 6000.3E
mr-I 8100R_XP

BCB/CYCLOTENE Mesitylene T1100

3022-X
4022-X

Epoxy/Acrylate Cyclopentanone/PGMEA Acetone

SU-8 2000 series
mr-DWL
LOR (1A, 3A, 5A)
mr-i 8030e
mr-NIL200
DELO-PRE/OM4310
OrmoStamp
Inkron
mr-I 8020E
OM4310

AR-P 617/AR-N 7520 PGME/PGMEA Acetone AR-N 7500 series
Polymer Ps-b-PDMS/block copolymer Heptane Ethyl Acetate
DIRTY bowlset Anything Organic Use the appropriate cleaning reagent for your resist


Equipment performance and process related parameters

Purpose Labspin

Spin coating of resist ONLY in dedicated bowlsets

Please do NOT use substances which is not for the dedicated bowlsets

All purpose

Spin coating of dirty substances in All purpose

Process parameters Spin speed
  • Vacuum chuck: 100 - 8000 rpm
  • Edge handling chuck: Max. 3000 rpm
Spin acceleration
  • 200 - 4000 rpm/s
Substrates Substrate size
  • Chips 5x5 mm and up
  • 50 mm wafers
  • 100 mm wafers
  • 150 mm wafers
Allowed materials

All cleanroom materials

Please ONLY use substances which is for the dedicated bowlsets in labspins

Batch

1


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