Specific Process Knowledge/Thin film deposition/Deposition of Silver: Difference between revisions

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== Sputter deposition of Silver ==
* [[/Sputter Ag in Wordentec|Sputter deposition of Silver in Wordentec]].
== Thermal deposition of Silver ==
* [[/Deposition of Silver|Thermal deposition of Silver in Wordentec]]
* [[/Deposition of Silver in Thermal Evaporator|Thermal deposition of Silver in the Thermal Evaporator]]
==Comparison of deposition equipment for silver==
{| border="1" cellspacing="0" cellpadding="4"  
{| border="1" cellspacing="0" cellpadding="4"  
|-style="background:silver; color:black"
|-style="background:silver; color:black"


!  
!  
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Alcatel|Alcatel]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|E-beam evaporator (Temescal)]] and [[Specific Process Knowledge/Thin film deposition/10-pocket e-beam evaporator|E-beam evaporator (10-pockets)]])
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/thermalevaporator|Thermal Evaporator]])
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Thermal evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Multisource PVD|PVD co-sputter/evaporation]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
! Sputter evaporation ([[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]])
! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
|-
|-style="background:WhiteSmoke; color:black"
! General description
| E-beam deposition of Ag (line-of-sight, very good thickness uniformity)
| Thermal deposition of Ag (line-of-sight)
| Thermal deposition of Ag (line-of-sight, good thickness uniformity)
| Sputter deposition of Ag (some step coverage, should have good uniformity)
| Sputter deposition of Ag (some step coverage)
| Sputter deposition of Ag including pulsed DC and HiPIMS
|-
|-style="background:LightGrey; color:black"
 
! Pre-clean
| Ar ion etch (only in E-beam evaporator Temescal)
| none
| none
| none
| RF Ar clean
| RF Ar clean
|-
|-style="background:WhiteSmoke; color:black"
 
! Layer thickness
|10Å to 1µm*
|10Å to 0.5µm **
|10Å to 0.5µm **(0.5µm not on all wafers)
|10Å to about 3000Å
|10Å to about 2000Å
|10Å to ?
|-
|-style="background:LightGrey; color:black"
 
! Deposition rate
|1 to 10Å/s
|5Å/s
|1 to 10Å/s
|Depending on [[/Sputter Ag in Wordentec|process parameters]] (also written in the logbook).
|Dependent on process parameters.
|Dependent on process parameters.
|-


|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
! Batch size
! Batch size
|
|
*Up to 1x4" wafers
*Up to 4x6" wafers or
*Up to 3x8" wafers *** or
*smaller pieces
|
*Up to 1x8" wafer or 1x6" wafer
*Up to 3x4" wafers
*smaller pieces
*smaller pieces
|
|
Line 30: Line 88:
*6x4" wafers or
*6x4" wafers or
*24x2" wafers  
*24x2" wafers  
|
*4x6" wafers or
*12x4" wafers or
*12x2" wafers
|
*4x6" wafers or
*12x4" wafers or
*12x2" wafers
|
|
*6x6" wafers or
*6x6" wafers or
*6x4" wafers or
*6x4" wafers or
*24x2" wafers  
*24x2" wafers  
|-
|-style="background:LightGrey; color:black"


! Pre-clean
|
|RF Ar clean
*1x6" wafers or
|RF Ar clean
*1x4" wafers or
|RF Ar clean
*smaller pieces
|RF Ar clean
|
|RF Ar clean
*up to 10x6" wafers or
*up to 10x4" wafers or
*many smaller pieces


|-style="background:Lightgrey; color:black"
!Allowed materials
|
*Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager.
|
*Almost any as long as it does not outgas. See cross-contamination sheets in Labmanager.
|
*Almost any as long as it does not outgas. See cross-contamination sheets in Labmanager.
|
*Almost any as long as it does not outgas. See cross-contamination sheets in Labmanager.
|
*Almost any as long as it does not outgas. See cross-contamination sheets in Labmanager.
|
*Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager.
|-style="background:whitesmoke; color:black"
! Comment
| Pumpdown approx 20 min. Possible to tilt the wafer to achieve tunable step coverage.
| Pumpdown approx 15 min.
| Only very thin layers. Pumpdown approx 1.5 hours.
| Pumpdown approx. 1.5 hours
|Load and transfer < 10 minutes
|Load and transfer approx. 12 minutes
|-
|-
|-style="background:WhiteSmoke; color:black"
|}
 
! Layer thickness
|10Å to 1µm
|10Å to 0.5µm (0.5µm not on all wafers)
|10Å to 1000Å
|10Å to about 5000Å
|10Å to about 3000Å
|-
|-style="background:LightGrey; color:black"


! Deposition rate
'''*'''  ''For thicknesses above 600 nm please get permission from ThinFilm group by writing to metal@nanolab.dtu.dk''
|2Å/s to 15Å/s
|1Å/s to 10 Å/s
|About 1Å/s
|Dependent on [[/Sputter rates for Ag PVD co-sputter/evaporation|process parameters]].
|Depending on process paramterers (see logbook)
|-
|}


'''**'''  ''For thicknesses above 200 nm please get permission from ThinFilm group by writing to metal@nanolab.dtu.dk''


[[/Deposition of Silver|Thermal deposition of Silver]] - ''Process settings for thermal deposition of Silver in Wordentec''
'''***'''  ''Please ask responsible staff for 8" wafer holder''

Latest revision as of 14:58, 22 January 2024

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Unless otherwise stated, this page is written by DTU Nanolab internal


Deposition of Silver

Silver can be deposited by e-beam evaporation, by sputtering and by thermal evaporation. In the chart below you can compare the different methods on the different deposition equipment.


Sputter deposition of Silver

Thermal deposition of Silver

Comparison of deposition equipment for silver

E-beam evaporation (E-beam evaporator (Temescal) and E-beam evaporator (10-pockets)) Thermal evaporation (Thermal Evaporator) Thermal evaporation (Wordentec) Sputter deposition (Wordentec) Sputter deposition (Lesker) Sputter deposition (Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3))
General description E-beam deposition of Ag (line-of-sight, very good thickness uniformity) Thermal deposition of Ag (line-of-sight) Thermal deposition of Ag (line-of-sight, good thickness uniformity) Sputter deposition of Ag (some step coverage, should have good uniformity) Sputter deposition of Ag (some step coverage) Sputter deposition of Ag including pulsed DC and HiPIMS
Pre-clean Ar ion etch (only in E-beam evaporator Temescal) none none none RF Ar clean RF Ar clean
Layer thickness 10Å to 1µm* 10Å to 0.5µm ** 10Å to 0.5µm **(0.5µm not on all wafers) 10Å to about 3000Å 10Å to about 2000Å 10Å to ?
Deposition rate 1 to 10Å/s 5Å/s 1 to 10Å/s Depending on process parameters (also written in the logbook). Dependent on process parameters. Dependent on process parameters.
Batch size
  • Up to 4x6" wafers or
  • Up to 3x8" wafers *** or
  • smaller pieces
  • Up to 1x8" wafer or 1x6" wafer
  • Up to 3x4" wafers
  • smaller pieces
  • 6x6" wafers or
  • 6x4" wafers or
  • 24x2" wafers
  • 6x6" wafers or
  • 6x4" wafers or
  • 24x2" wafers
  • 1x6" wafers or
  • 1x4" wafers or
  • smaller pieces
  • up to 10x6" wafers or
  • up to 10x4" wafers or
  • many smaller pieces
Allowed materials
  • Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager.
  • Almost any as long as it does not outgas. See cross-contamination sheets in Labmanager.
  • Almost any as long as it does not outgas. See cross-contamination sheets in Labmanager.
  • Almost any as long as it does not outgas. See cross-contamination sheets in Labmanager.
  • Almost any as long as it does not outgas. See cross-contamination sheets in Labmanager.
  • Almost any as long as it does not outgas if you plan to use substrate heating. See cross-contamination sheets in Labmanager.
Comment Pumpdown approx 20 min. Possible to tilt the wafer to achieve tunable step coverage. Pumpdown approx 15 min. Only very thin layers. Pumpdown approx 1.5 hours. Pumpdown approx. 1.5 hours Load and transfer < 10 minutes Load and transfer approx. 12 minutes

* For thicknesses above 600 nm please get permission from ThinFilm group by writing to metal@nanolab.dtu.dk

** For thicknesses above 200 nm please get permission from ThinFilm group by writing to metal@nanolab.dtu.dk

*** Please ask responsible staff for 8" wafer holder

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