Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using ASE/tests CHF3+H2: Difference between revisions
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|<!--'''Process time'''--> '''10:00''' | |<!--'''Process time'''--> '''10:00''' | ||
|<!--'''Date'''--> 23/10/23 | |<!--'''Date'''--> 23/10/23 | ||
|<!--'''SEM picture'''--> | |<!--'''SEM picture'''--> [[File:CHF_t2 nP 10min-05.png|200px]] | ||
|<!--'''Etch rate in SiO2'''--> 27 | |<!--'''Etch rate in SiO2'''--> 27 | ||
|<!--'''Etch rate in resist'''--> 12,5 | |<!--'''Etch rate in resist'''--> 12,5 | ||
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|<!--'''Process time'''--> '''20:00''' | |<!--'''Process time'''--> '''20:00''' | ||
|<!--'''Date'''--> 23/10/23 | |<!--'''Date'''--> 23/10/23 | ||
|<!--'''SEM picture'''--> | |<!--'''SEM picture'''--> [[File:CHF_t2 nP 20min-02.png|200px]] | ||
|<!--'''Etch rate in SiO2'''--> 8.15 | |<!--'''Etch rate in SiO2'''--> 8.15 | ||
|<!--'''Etch rate in resist'''--> 7.5 | |<!--'''Etch rate in resist'''--> 7.5 |
Revision as of 13:18, 14 December 2023
Recipes and results - CHF3 tests
Tests performed with AZ5214E resist: