Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using ASE/tests CHF3+H2: Difference between revisions

From LabAdviser
Jump to navigation Jump to search
Line 8: Line 8:
! '''Date'''
! '''Date'''
! '''SEM picture'''
! '''SEM picture'''
! '''SEM pic w/ no resist'''
! '''Redeposition - top view'''
! '''Redeposition - top view'''
! '''Profile angles'''
! '''Profile angles'''
Line 23: Line 22:
|<!--'''Date'''--> 04/09/2023
|<!--'''Date'''--> 04/09/2023
|<!--'''SEM picture'''--> [[File:CHF3 t1 pat C 01.png|200px]]
|<!--'''SEM picture'''--> [[File:CHF3 t1 pat C 01.png|200px]]
|<!--'''SEM pic w/ no resist'''-->
|<!--'''Redeposition - top view'''--> [[File:CHF3 t1 12min af PA 03.png|200px]]
|<!--'''Redeposition - top view'''--> [[File:CHF3 t1 12min af PA 03.png|200px]]
|<!--'''Profile angles'''-->  
|<!--'''Profile angles'''-->  
Line 38: Line 36:
|<!--'''Date'''--> 04/09/2023
|<!--'''Date'''--> 04/09/2023
|<!--'''SEM picture'''--> [[File:CHF3 t2 pat C 05.png|200px]]
|<!--'''SEM picture'''--> [[File:CHF3 t2 pat C 05.png|200px]]
|<!--'''SEM pic w/ no resist'''-->
|<!--'''Redeposition - top view'''--> [[File:CHF3 t2 25min af PA 05.png|200px]]
|<!--'''Redeposition - top view'''--> [[File:CHF3 t2 25min af PA 05.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF3 t2 pat C 03.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF3 t2 pat C 03.png|200px]]
Line 53: Line 50:
|<!--'''Date'''--> 22/09/2023
|<!--'''Date'''--> 22/09/2023
|<!--'''SEM picture'''--> [[File:CHF3.t2-10H2-25min-C-01.png|200px]]
|<!--'''SEM picture'''--> [[File:CHF3.t2-10H2-25min-C-01.png|200px]]
|<!--'''SEM pic w/ no resist'''-->
|<!--'''Redeposition - top view'''--> [[File:CHF3.t2 22.5H2 10min af PA 02.png|200px]]
|<!--'''Redeposition - top view'''--> [[File:CHF3.t2 22.5H2 10min af PA 02.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF3.t2-10H2-25min-C-08.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF3.t2-10H2-25min-C-08.png|200px]]
Line 68: Line 64:
|<!--'''Date'''--> 12/09/2023
|<!--'''Date'''--> 12/09/2023
|<!--'''SEM picture'''--> [[File:CHF310 H2 10min 08.png|200px]]
|<!--'''SEM picture'''--> [[File:CHF310 H2 10min 08.png|200px]]
|<!--'''SEM pic w/ no resist'''-->
|<!--'''Redeposition - top view'''--> [[File:CHF310 H2 10min af PA top 01.png|200px]]
|<!--'''Redeposition - top view'''--> [[File:CHF310 H2 10min af PA top 01.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF310 H2 10min 10.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF310 H2 10min 10.png|200px]]
Line 83: Line 78:
|<!--'''Date'''--> 11/09/2023
|<!--'''Date'''--> 11/09/2023
|<!--'''SEM picture'''--> [[File:CHF310 O2 10min 01.png|200px]]
|<!--'''SEM picture'''--> [[File:CHF310 O2 10min 01.png|200px]]
|<!--'''SEM pic w/ no resist'''-->
|<!--'''Redeposition - top view'''--> [[File:CHF310 O2 10min af PA top 02.png|200px]]
|<!--'''Redeposition - top view'''--> [[File:CHF310 O2 10min af PA top 02.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF310 O2 10min 04.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF310 O2 10min 04.png|200px]]
Line 98: Line 92:
|<!--'''Date'''--> 20/09/2023
|<!--'''Date'''--> 20/09/2023
|<!--'''SEM picture'''--> [[File:CHF3=22.5 H2 10min C 01.png|200px]]
|<!--'''SEM picture'''--> [[File:CHF3=22.5 H2 10min C 01.png|200px]]
|<!--'''SEM pic w/ no resist'''-->
|<!--'''Redeposition - top view'''--> [[File:CHF3.t1 22.5H2 10min af PA 02.png|200px]]
|<!--'''Redeposition - top view'''--> [[File:CHF3.t1 22.5H2 10min af PA 02.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF3=22.5 H2 10min C 03.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF3=22.5 H2 10min C 03.png|200px]]
Line 113: Line 106:
|<!--'''Date'''--> 22/09/2023
|<!--'''Date'''--> 22/09/2023
|<!--'''SEM picture'''--> [[File:CHF3 35H2 10min C 02.png|200px]]
|<!--'''SEM picture'''--> [[File:CHF3 35H2 10min C 02.png|200px]]
|<!--'''SEM pic w/ no resist'''-->
|<!--'''Redeposition - top view'''--> [[File:CHF3 35H2 10min af PA 01.png|200px]]
|<!--'''Redeposition - top view'''--> [[File:CHF3 35H2 10min af PA 01.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF3 35H2 10min D 05.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF3 35H2 10min D 05.png|200px]]
Line 128: Line 120:
|<!--'''Date'''--> 22/09/2023
|<!--'''Date'''--> 22/09/2023
|<!--'''SEM picture'''--> [[File:CHF3 3535H2 10min E 01.png|200px]]
|<!--'''SEM picture'''--> [[File:CHF3 3535H2 10min E 01.png|200px]]
|<!--'''SEM pic w/ no resist'''-->
|<!--'''Redeposition - top view'''--> [[File:CHF3 35.35H2 10min af PA 01.png|200px]]
|<!--'''Redeposition - top view'''--> [[File:CHF3 35.35H2 10min af PA 01.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF3 3535H2 10min C 06.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF3 3535H2 10min C 06.png|200px]]
Line 143: Line 134:
|<!--'''Date'''--> 22/09/2023
|<!--'''Date'''--> 22/09/2023
|<!--'''SEM picture'''--> [[File:CHF3.t1 22.5CF4 10min C 01.png|200px]]
|<!--'''SEM picture'''--> [[File:CHF3.t1 22.5CF4 10min C 01.png|200px]]
|<!--'''SEM pic w/ no resist'''-->
|<!--'''Redeposition - top view'''--> [[File:CHF3 22.5CF4 10min af PA 01.png|200px]]
|<!--'''Redeposition - top view'''--> [[File:CHF3 22.5CF4 10min af PA 01.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF3.t1 22.5CF4 10min C 03.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF3.t1 22.5CF4 10min C 03.png|200px]]
Line 158: Line 148:
|<!--'''Date'''--> 22/09/2023
|<!--'''Date'''--> 22/09/2023
|<!--'''SEM picture'''--> [[File:CHF3.t122.5H2 25mT 10m C 04.png|200px]]
|<!--'''SEM picture'''--> [[File:CHF3.t122.5H2 25mT 10m C 04.png|200px]]
|<!--'''SEM pic w/ no resist'''-->
|<!--'''Redeposition - top view'''--> [[File:CHF3 22.5H2 25mT 10mn af PA 01.png|200px]]
|<!--'''Redeposition - top view'''--> [[File:CHF3 22.5H2 25mT 10mn af PA 01.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF3.t122.5H2 25mT 10m C 03.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF3.t122.5H2 25mT 10m C 03.png|200px]]
Line 173: Line 162:
|<!--'''Date'''--> 22/09/2023
|<!--'''Date'''--> 22/09/2023
|<!--'''SEM picture'''--> [[File:CHF3-22.5-H2-10min-0C-C-03.png|200px]]
|<!--'''SEM picture'''--> [[File:CHF3-22.5-H2-10min-0C-C-03.png|200px]]
|<!--'''SEM pic w/ no resist'''-->
|<!--'''Redeposition - top view'''--> [[File:CHF3 22.5H2 10min 0C af PA 01.png|200px]]
|<!--'''Redeposition - top view'''--> [[File:CHF3 22.5H2 10min 0C af PA 01.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF3-22.5-H2-10min-0C-C-07.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF3-22.5-H2-10min-0C-C-07.png|200px]]
Line 199: Line 187:
! '''Date'''
! '''Date'''
! '''SEM picture'''
! '''SEM picture'''
! '''SEM pic w/ no resist'''
! '''Redeposition - top view'''
! '''Profile angles'''
! '''Profile angles'''
! '''Etch rate in SiO2'''
! '''Etch rate in SiO2'''
Line 214: Line 200:
|<!--'''Date'''--> 04/09/2023
|<!--'''Date'''--> 04/09/2023
|<!--'''SEM picture'''--> [[File:CHF3 t1 pat C 01.png|200px]]
|<!--'''SEM picture'''--> [[File:CHF3 t1 pat C 01.png|200px]]
|<!--'''SEM pic w/ no resist'''-->
|<!--'''Redeposition - top view'''--> [[File:CHF3 t1 12min af PA 03.png|200px]]
|<!--'''Profile angles'''-->  
|<!--'''Profile angles'''-->  
|<!--'''Etch rate in SiO2'''--> 69.7 nm/min <br> +/- 10.5%
|<!--'''Etch rate in SiO2'''--> 69.7 nm/min <br> +/- 10.5%
Line 229: Line 213:
|<!--'''Date'''--> 04/09/2023
|<!--'''Date'''--> 04/09/2023
|<!--'''SEM picture'''--> [[File:CHF3 t2 pat C 05.png|200px]]
|<!--'''SEM picture'''--> [[File:CHF3 t2 pat C 05.png|200px]]
|<!--'''SEM pic w/ no resist'''-->
|<!--'''Redeposition - top view'''--> [[File:CHF3 t2 25min af PA 05.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF3 t2 pat C 03.png|200px]]
|<!--'''Profile angles'''--> [[File:CHF3 t2 pat C 03.png|200px]]
|<!--'''Etch rate in SiO2'''--> 26.7 nm/min <br> +/- 11.9%
|<!--'''Etch rate in SiO2'''--> 26.7 nm/min <br> +/- 11.9%

Revision as of 12:12, 14 December 2023

Recipes and results - CHF3 tests

Tests performed with AZ5214E resist:

Recipe Recipe parameters Process time Date SEM picture Redeposition - top view Profile angles Etch rate in SiO2 Etch rate in resist
(AZ5214E inverse)
Selectivity
(SiO2:resist)
Etch rate in Si
CHF3_t1 CHF3= 22.5 sccm
Coil= 800W
Platen= 15W
Press= 2.5mTorr
Temp= 20°C
12:00 min 04/09/2023 CHF3 t1 pat C 01.png CHF3 t1 12min af PA 03.png 69.7 nm/min
+/- 10.5%
57.3 nm/min
+/- 12.9%
1.22
CHF3_t2 CHF3= 22.5 sccm
Coil= 150W
Platen= 25W
Press= 2.5mTorr
Temp= 20°C
25:00 min 04/09/2023 CHF3 t2 pat C 05.png CHF3 t2 25min af PA 05.png CHF3 t2 pat C 03.png 26.7 nm/min
+/- 11.9%
24.2 nm/min
+/- 21.1%
1.1
CHF3 t2 CHF3= 22.5 sccm
H2= 22.5 sccm
Coil= 150W
Platen= 25W
Press= 2.5mTorr
Temp= 20°C
10:00 min 22/09/2023 CHF3.t2-10H2-25min-C-01.png CHF3.t2 22.5H2 10min af PA 02.png CHF3.t2-10H2-25min-C-08.png 9,7 nm/min
+/- 34.4%
1,8 nm/min
+/- 46.5%
5.4
CHF3_t1 CHF3= 22.5 sccm
H2= 10 sccm
Coil= 800W
Platen= 15W
Press= 2.5mTorr
Temp= 20°C
10:00 min 12/09/2023 CHF310 H2 10min 08.png CHF310 H2 10min af PA top 01.png CHF310 H2 10min 10.png 59,6 nm/min
+/- 12.9%
47,5 nm/min
+/- 21.5%
1.25
CHF3_t1 CHF3= 22.5 sccm
O2= 10 sccm
Coil= 800W
Platen= 15W
Press= 2.5mTorr
Temp= 20°C
10:00 min 11/09/2023 CHF310 O2 10min 01.png CHF310 O2 10min af PA top 02.png CHF310 O2 10min 04.png 60,6 nm/min
+/- 10.1%
130,8 nm/min
+/- 8.8%
0.46
CHF3 t1 CHF3= 22.5 sccm
H2= 22.5 sccm
Coil= 800W
Platen= 15W
Press= 2.5mTorr
Temp= 20°C
10:00 min 20/09/2023 CHF3=22.5 H2 10min C 01.png CHF3.t1 22.5H2 10min af PA 02.png CHF3=22.5 H2 10min C 03.png 47,3 nm/min
+/- 12%
26,4 nm/min
+/- 17,4%
1.8
CHF3 t1 CHF3= 22.5 sccm
H2= 35 sccm
Coil= 800W
Platen= 15W
Press= 2.5mTorr
Temp= 20°C
10:00 min 22/09/2023 CHF3 35H2 10min C 02.png CHF3 35H2 10min af PA 01.png CHF3 35H2 10min D 05.png 36,5 nm/min
+/- 10.6%
17,5 nm/min
+/- 13.9%
2.09
CHF3 t1 CHF3= 35 sccm
H2= 35 sccm
Coil= 800W
Platen= 15W
Press= 2.5mTorr
Temp= 20°C
10:00 min 22/09/2023 CHF3 3535H2 10min E 01.png CHF3 35.35H2 10min af PA 01.png CHF3 3535H2 10min C 06.png 42 nm/min
+/- 15.4%
23,8 nm/min
+/- 22.2%
1.76
CHF3 t1 CHF3= 22.5 sccm
CF4= 22.5 sccm
Coil= 800W
Platen= 15W
Press= 2.5mTorr
Temp= 20°C
10:00 min 22/09/2023 CHF3.t1 22.5CF4 10min C 01.png CHF3 22.5CF4 10min af PA 01.png CHF3.t1 22.5CF4 10min C 03.png 75,8 nm/min
+/- 13.1%
74,9 nm/min
+/- 10.8%
1.01
CHF3 t1 CHF3= 22.5 sccm
H2= 22.5 sccm
Coil= 800W
Platen= 15W
Press= 25mTorr
Temp= 20°C
10:00 min 22/09/2023 CHF3.t122.5H2 25mT 10m C 04.png CHF3 22.5H2 25mT 10mn af PA 01.png CHF3.t122.5H2 25mT 10m C 03.png - - no etch done,
polymer deposited
CHF3 t1 CHF3= 22.5 sccm
H2= 22.5 sccm
Coil= 800W
Platen= 15W
Press= 2.5mTorr
Temp= 0°C
10:00 min 22/09/2023 CHF3-22.5-H2-10min-0C-C-03.png CHF3 22.5H2 10min 0C af PA 01.png CHF3-22.5-H2-10min-0C-C-07.png 48 nm/min
+/- 11.2%
23,3 nm/min
+/- 13.7%
2.06





Tests performed with 915nm UVN resist + 88nm BARC:

Recipe Recipe parameters Process time Date SEM picture Profile angles Etch rate in SiO2 Etch rate in resist
(AZ5214E inverse)
Selectivity
(SiO2:resist)
Etch rate in Si
CHF3_t1 CHF3= 22.5 sccm
Coil= 800W
Platen= 15W
Press= 2.5mTorr
Temp= 20°C
12:00 min 04/09/2023 CHF3 t1 pat C 01.png 69.7 nm/min
+/- 10.5%
57.3 nm/min
+/- 12.9%
1.22
CHF3_t2 CHF3= 22.5 sccm
Coil= 150W
Platen= 25W
Press= 2.5mTorr
Temp= 20°C
25:00 min 04/09/2023 CHF3 t2 pat C 05.png CHF3 t2 pat C 03.png 26.7 nm/min
+/- 11.9%
24.2 nm/min
+/- 21.1%
1.1