Specific Process Knowledge/Etch/DRIE-Pegasus/Isotropic/mediumiso1: Difference between revisions
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Latest revision as of 11:31, 28 June 2023
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| Date | Substrate Information | Process Information | SEM Images | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Wafer info | Mask | Material/ Exposed area | Tool / Operator | Conditioning | Recipe | Wafer ID | Comments | ||
| 9/4-2014 | 4" | travka05 wafer 1.5 µm AZ | Si / 5 % | Pegasus/jmli | 5 minute TDESC clean + MU runs | jml/isotropic/mediumiso1 2:00 minutes | S003961 |
| |
| 6/6-2016 | 6" | travka35 wafer 1.5 µm AZ | Si / 35 % | Pegasus/jmli | standard/danchip/mediumiso1 2:00 minutes | S006534 |
| ||
| 6/6-2016 | 6" | travka35 wafer 1.5 µm AZ | Si / 35 % | Pegasus/jmli | standard/danchip/mediumiso1 4:00 minutes | S006535 |
| ||
