Specific Process Knowledge/Etch/DRIE-Pegasus/Isotropic/mediumiso1: Difference between revisions

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| 6/6-2016
| 6"
| travka35 wafer 1.5 µm AZ
| Si / 35 %
| Pegasus/jmli
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| standard/danchip/mediumiso1 2:00 minutes
| S006534
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| 6/6-2016
| 6"
| travka35 wafer 1.5 µm AZ
| Si / 35 %
| Pegasus/jmli
|
| standard/danchip/mediumiso1 4:00 minutes
| S006535
|
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Latest revision as of 11:31, 28 June 2023

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Process runs
Date Substrate Information Process Information SEM Images
Wafer info Mask Material/ Exposed area Tool / Operator Conditioning Recipe Wafer ID Comments
9/4-2014 4" travka05 wafer 1.5 µm AZ Si / 5 % Pegasus/jmli 5 minute TDESC clean + MU runs jml/isotropic/mediumiso1 2:00 minutes S003961

6/6-2016 6" travka35 wafer 1.5 µm AZ Si / 35 % Pegasus/jmli standard/danchip/mediumiso1 2:00 minutes S006534

6/6-2016 6" travka35 wafer 1.5 µm AZ Si / 35 % Pegasus/jmli standard/danchip/mediumiso1 4:00 minutes S006535