Specific Process Knowledge/Etch/DRIE-Pegasus/Isotropic/mediumiso1: Difference between revisions
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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/Isotropic/mediumiso1 click here]''' | |||
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| 6/6-2016 | |||
| 6" | |||
| travka35 wafer 1.5 µm AZ | |||
| Si / 35 % | |||
| Pegasus/jmli | |||
| | |||
| standard/danchip/mediumiso1 2:00 minutes | |||
| S006534 | |||
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|- | |||
| 6/6-2016 | |||
| 6" | |||
| travka35 wafer 1.5 µm AZ | |||
| Si / 35 % | |||
| Pegasus/jmli | |||
| | |||
| standard/danchip/mediumiso1 4:00 minutes | |||
| S006535 | |||
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Latest revision as of 11:31, 28 June 2023
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Unless otherwise stated, the content of this page was created by the dry etch group at DTU Nanolab
Date | Substrate Information | Process Information | SEM Images | ||||||
---|---|---|---|---|---|---|---|---|---|
Wafer info | Mask | Material/ Exposed area | Tool / Operator | Conditioning | Recipe | Wafer ID | Comments | ||
9/4-2014 | 4" | travka05 wafer 1.5 µm AZ | Si / 5 % | Pegasus/jmli | 5 minute TDESC clean + MU runs | jml/isotropic/mediumiso1 2:00 minutes | S003961 | ||
6/6-2016 | 6" | travka35 wafer 1.5 µm AZ | Si / 35 % | Pegasus/jmli | standard/danchip/mediumiso1 2:00 minutes | S006534 | |||
6/6-2016 | 6" | travka35 wafer 1.5 µm AZ | Si / 35 % | Pegasus/jmli | standard/danchip/mediumiso1 4:00 minutes | S006535 |