Specific Process Knowledge/Thin film deposition/ALD Picosun R200/ZnO deposition using ALD: Difference between revisions

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The ALD window for deposition of zinc oxide (ZnO) ranges from 100 <sup>o</sup>C to 250 <sup>o</sup>C. Several investigation techniques has been implemented for ZnO characterization. Additionally, more information on ZnO can be found on a page about [[Specific_Process_Knowledge/Thin_film_deposition/ALD_Picosun_R200/AZO_deposition_using_ALD|Al-doped ZnO (AZO)]]
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/ALD_Picosun_R200/ZnO_deposition_using_ALD  click here]'''


All results shown on this page have been obtained using the "ZnOT" recipe on new Si(100) wafers with native oxide:
''This page is written by DTU Nanolab internal''


==Al<sub>2</sub>O<sub>3</sub> standard recipe==


<b>Recipe: AL2O3</b>
<br clear="all" />
 
====''Obsolete - ZnO should now be deposited in ALD2''====
 
<br clear="all" />
 
Deposition of ZnO is a standard, well-explored ALD process.
Previously (before 2018), DEZ had its independent inlet (A1), which shared the same N2 line with the TiCl4 precursor (A2). The DEZ precursor bottle was placed in a cabinet behind the instrument in the service area, and a long pipe led the precursor to the ALD chamber. This option has been abandoned due to safety reasons. This line was very difficult to purge in case of service. The results that were obtained with the old hardware configuration now remain [[Specific_Process_Knowledge/Thin_film_deposition/ALD_Picosun_R200/ZnO deposition using ALD/Obsolete|obsolete]].
Nowadays, if the user wants to deposit ZnO, in ALD-1 the diethyl zinc (DEZ) has to be mounted in the A-line. If TiCl4 is currently present it has to be exchanged with DEZ. This is a time-consuming job, that needs to be ordered and prepared in advance.
 
=ZnO ALD deposition using DEZ and H<sub>2</sub>O=
 
ZnO can be deposited in the range between 100 <sup>o</sup>C to 225 <sup>o</sup>C. It is not recommended to increase the temperature above 225<sup>o</sup>C, as the uniformity suffers due to the precursor decomposition. The maximum temperature can be 250<sup>o</sup>C, here however the film crystal quality, crystallinity, roughness, etc. sufficiently differ from the films prepared in a lower temperature range.
 
 
All results shown on this page have been obtained using the present (from 2018) configuration.
Deposition and characterization has been performed in <b>2021 by Evgeniy Shkondin, DTU Nanolab</b>
 
=ZnO recipes=
 
==<b>Recipe: ZnO</b>==


<b>Maximum deposition thickness: 100 nm</b>
<b>Maximum deposition thickness: 100 nm</b>


<b>Temperature: 100 <sup>o</sup>C - 350 <sup>o</sup>C</b>
<b>Temperature: 100 <sup>o</sup>C - 250 <sup>o</sup>C</b>


{| border="2" cellspacing="2" cellpadding="5"  align="none"
{| border="2" cellspacing="2" cellpadding="5"  align="none"
|-  
|-  
|
|
!TMA
!DEZ*
!H<sub>2</sub>O
!H<sub>2</sub>O
|-
|-
Line 26: Line 45:
|-  
|-  
!Purge time
!Purge time
|3.0 s
|5.0 s
|4.0 s
|5.0 s
|-
|-
|}
|}


This is the standard recipe for deposition of Al<sub>2</sub>O<sub>3</sub> on flat and high aspect ratio structures. For conformal passivation of porous materials, very narrow trenches etc. it is recomanded to use <b>Al2O3T</b> recipe instead. Recipe can be used for deposition in the range 100-350 <sup>o</sup>C. However, at 100 <sup>o</sup>C small amount of carbon impurities has been observed. It is not recomanded to use this recipe for deposition below 100 <sup>o</sup>C, since it also leads to accumulation of H<sub>2</sub>O in the chamber.
This is a standard recipe of ZnO. It is suitable for coating the flat samples and structures with an aspect ratio of around up to 1:10.


===Al<sub>2</sub>O<sub>3</sub> deposition rates===
==<b>Recipe: ZnOT</b>==


The deposition rate for Al<sub>2</sub>O<sub>3</sub> depends on the temperature, see the ALD-window graph below.  The uniformity, thickness, refractive index has been obtained using [[Specific_Process_Knowledge/Characterization/Optical_characterization#Ellipsometer|Ellipsometer VASE]].
<b>Maximum deposition thickness: 100 nm</b>


<b>Temperature: 100 <sup>o</sup>C - 250 <sup>o</sup>C</b>


<gallery caption="" widths="500px" heights="500px" perrow="2">
{| border="2" cellspacing="2" cellpadding="5" align="none"
image:ALD_window.jpg| ALD-window for Al<sub>2</sub>O<sub>3</sub> deposition.
|-  
image:SE_Al2O3_ALD_typical.JPG| Typical uniformity profile across 100mm Si wafer based on 49 mesurement points.
|
</gallery>
!DEZ<sup>*</sup>
!DEZ
!H<sub>2</sub>O
!H<sub>2</sub>O
|-
!Nitrogen flow
|150 sccm
|150 sccm
|200 sccm
|200 sccm
|-
!Pulse time
|0.1 s
|0.1 s
|0.1 s
|0.1 s
|-
!Purge time
|0.5 s
|20.0 s
|0.5 s
|20.0 s
|-
|}


In the graphs below the Al<sub>2</sub>O<sub>3</sub> thickness as function of number of cycles for deposition temperatures between 100 <sup>o</sup>C and 350 <sup>o</sup>C can be seen. From the equations the number of cycles required for a certain thickess can be calculated.
<br clear="all" />
 
This is a more complicated recipe that allows coating the sample with very high aspect ratio profiles. One SEM example is shown on one of the images below. The recipe is good for deposition on very high aspect ratio structures (with aspect ratio more than 1:20) such as deep trenches, pillars, pores etc. <b>ZnOT</b> recipe can also be used for deposition on polymers at low temperatures (80-120 <sup>o</sup>C).
 
 
<gallery caption="Aluminium oxide thickness as function of number of cycles" widths="500px" heights="500px" perrow="3">
image:Al2O3 100C.jpg| Temperature 100 <sup>o</sup>C.
image:Al2O3 150C.jpg| Temperature 150 <sup>o</sup>C.
image:Al2O3 200C.jpg| Temperature 200 <sup>o</sup>C.
</gallery>


<gallery caption="Aluminium oxide thickness as function of number of cycles" widths="500px" heights="500px" perrow="3">
image:Al2O3 250C.jpg| Temperature 250 <sup>o</sup>C.
image:Al2O3 300C.jpg| Temperature 300 <sup>o</sup>C.
image:Al2O3 350C.jpg| Temperature 350 <sup>o</sup>C.
</gallery>
<br clear="all" />
<b>Evgeniy Shkondin, DTU Danchip, 2014-2016.</b>
<br clear="all" />
<br clear="all" />
<strong>DEZ</strong> is diethylzinc Zn(CH<sub>2</sub>CH<sub>3</sub>)<sub>2</sub> or ZnEt<sub>2</sub>
<br clear="all" />
<br clear="all" />


===Al<sub>2</sub>O<sub>3</sub> standard recipe characterization across 100 mm Si <100> wafer ===
=Deposition characteristics=




The deposition rate for ZnO depends on the temperature, see the ALD-window graph below.  The uniformity, thickness, refractive index has been obtained using Ellipsometer VASE.


==Deposition rate==


{| border="2" cellspacing="2" cellpadding="3" colspan="10"
In the graphs below the ZnO thickness vs. number of cycles for deposition temperatures between 100 <sup>o</sup>C and 250 <sup>o</sup>C presented. Results have been obtained for <100> 100 mm Si wafers with native oxide, based on [[Specific_Process_Knowledge/Characterization/Optical_characterization#Ellipsometer|ellipsometry]] study. The optical model used in fitting is based on Tauc-Lorentz and two Lorentz oscillators.
|bgcolor="#98FB98" |'''Al<sub>2</sub>O<sub>3</sub> deposition at 100 <sup>o</sup>C and 150 <sup>o</sup>C'''
|-
|


<gallery caption="" widths="400px" heights="400px" perrow="2">
image:eves_dep_rate_ZnO_100C_ALD1_20220223.png|Deposition rate of ZnO at 100 <sup>o</sup>C. Substrate: Silicon 4" wafer with native oxide. <br> <math> Thickness (nm) = 0.1483 \cdot N + 0.63 </math>
image:eves_dep_rate_ZnO_150C_ALD1_20220223.png|Deposition rate of ZnO at 150 <sup>o</sup>C. Substrate: Silicon 4" wafer with native oxide. <br> <math> Thickness (nm) = 0.1954 \cdot N - 2.73 </math>
image:eves_dep_rate_ZnO_200C_ALD1_20220223.png|Deposition rate of ZnO at 200 <sup>o</sup>C. Substrate: Silicon 4" wafer with native oxide. <br> <math> Thickness (nm) = 0.1842 \cdot N - 3.80 </math>
image:eves_dep_rate_ZnO_250C_ALD1_20220223.png|Deposition rate of ZnO at 250 <sup>o</sup>C. Substrate: Silicon 4" wafer with native oxide. <br> <math> Thickness (nm) = 0.1326 \cdot N + 1.13 </math>
image:eves_ALD_window_ZnO_ALD1_20220223.png|ALD window of ZnO
</gallery>


{| {{table}}
<br clear="all" />
| align="center" |
{| border="2" cellspacing="2" cellpadding="3"  align="center" style="width:750px"
! colspan="5" |Deposition conditions at 100 <sup>o</sup>C
|-
!Number of cycles
|<b>Thickness (nm)</b>
|<b>Uniformity across 100mm Si substrate (%)</b>
|<b>Standard deviation error</b>
|<b>Refractive index @ 632.8 nm</b>


|-
==Uniformity across 100 mm wafer==
|150
|14.11
|2.18
|0.225
|1.56


|-  
Recipe "ZnO" Samples: 100mm ssp-Si
|300
|25.94
|0.68
|0.14
|1.59


|-
Results have been obtained for <100> 100 mm Si wafers with native oxide, based on [[Specific_Process_Knowledge/Characterization/Optical_characterization#Ellipsometer|ellipsometry]] study.
|500
|41.35
|1.87
|0.60
|1.59


|-
{| border="2" cellspacing="0" cellpadding="9"
|800
|65.05
|2.28
|1.13
|1.59


|-
!colspan="1" border="none" style="background:silver; color:black;" align="center"|Temperature (&deg;C) / Number of cycles
|1088
|style="background:silver; color:black"|<b>Deposition rate (nm/s)</b>
|87.25
|style="background:silver; color:black"|<b>Average thickness (nm)</b>
|2.15
|style="background:silver; color:black"|<b>Standard deviation</b>
|1.35
|style="background:silver; color:black"|<b>Uniformity (%)</b>
|1.60


|-
|-
|}
!style="background:silver; color:black;" align="center" |100&deg;C / 500cycles


|style="background:WhiteSmoke; color:black" align="center"|<b><span style="color: red">0.1483</span></b>


| align="center" valign="top"|
|style="background:WhiteSmoke; color:black" align="center"|75.67
{| border="2" cellspacing="2" cellpadding="3" align="center" style="width:750px"
! colspan="5" |Deposition conditions at 150 <sup>o</sup>C
|-
!Number of cycles
|<b>Thickness (nm)</b>
|<b>Uniformity across 100mm Si substrate (%)</b>
|<b>Standard deviation error</b>
|<b>Refractive index @ 632.8 nm</b>


|-
|style="background:WhiteSmoke; color:black" align="center"|1.49
|150
|15.38
|1.72
|0.18
|1.61
 
|-
|300
|28.67
|1.73
|0.36
|1.62


|-
|style="background:WhiteSmoke; color:black" align="center"|3.26
|500
|46.93
|1.75
|0.57
|1.62


|-
|800
|73.46
|1.75
|0.92
|1.63
|-
|1088
|99.50
|1.74
|1.20
|1.63
|-
|}
|-
|-
|}
!style="background:silver; color:black;" align="center" |150&deg;C / 500cycles
|}


%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%
|style="background:WhiteSmoke; color:black" align="center"|<b><span style="color: red">0.1954</span></b>


|style="background:WhiteSmoke; color:black" align="center"|95.32


{| border="2" cellspacing="2" cellpadding="3" colspan="10"
|style="background:WhiteSmoke; color:black" align="center"|1.32
|bgcolor="#98FB98" |'''Al<sub>2</sub>O<sub>3</sub> deposition at 200 <sup>o</sup>C and 250 <sup>o</sup>C'''
|-
|


|style="background:WhiteSmoke; color:black" align="center"|2.44


{| {{table}}
| align="center" |
{| border="2" cellspacing="2" cellpadding="3"  align="center" style="width:750px"
! colspan="5" |Deposition conditions at 200 <sup>o</sup>C
|-
|-
!Number of cycles
!style="background:silver; color:black;" align="center" |200&deg;C / 500cycles
|<b>Thickness (nm)</b>
|<b>Uniformity across 100mm Si substrate (%)</b>
|<b>Standard deviation error</b>
|<b>Refractive index @ 632.8 nm</b>
 
|-
|150
|16.46
|2.92
|0.33
|1.62
 
|-
|300
|31.09
|1.53
|0.34
|1.63
 
|-
|500
|51.20
|1.10
|0.39
|1.64
 
|-
|800
|79.66
|1.59
|0.88
|1.64


|-
|style="background:WhiteSmoke; color:black" align="center"|<b><span style="color: red">0.1842</span></b>
|1088
|107.69
|1.41
|1.04
|1.64


|-
|style="background:WhiteSmoke; color:black" align="center"|87.97
|}


|style="background:WhiteSmoke; color:black" align="center"|0.31


| align="center" valign="top"|
|style="background:WhiteSmoke; color:black" align="center"|0.63
{| border="2" cellspacing="2" cellpadding="3" align="center" style="width:750px"
! colspan="5" |Deposition conditions at 250 <sup>o</sup>C
|-
!Number of cycles
|<b>Thickness (nm)</b>
|<b>Uniformity across 100mm Si substrate (%)</b>
|<b>Standard deviation error</b>
|<b>Refractive index @ 632.8 nm</b>


|-
|-
|150
!style="background:silver; color:black;" align="center" |225&deg;C / 500cycles
|16.41
|0.83
|0.10
|1.63
 
|-
|300
|30.81
|1.13
|0.24
|1.64


|-
|style="background:WhiteSmoke; color:black" align="center"|<b><span style="color: red">0.1622</span></b>
|500
|50.48
|1.10
|0.40
|1.64


|-
|style="background:WhiteSmoke; color:black" align="center"|81.09
|800
|79.84
|1.11
|0.60
|1.65


|-
|style="background:WhiteSmoke; color:black" align="center"|0.45
|1088
|108.03
|1.11
|0.61
|1.65
 
|-
|}
|-
|}
|}
%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%%


|style="background:WhiteSmoke; color:black" align="center"|1.07


{| border="2" cellspacing="2" cellpadding="3" colspan="10"
|bgcolor="#98FB98" |'''Al<sub>2</sub>O<sub>3</sub> deposition at 300 <sup>o</sup>C and 350 <sup>o</sup>C'''
|-
|-
|
!style="background:silver; color:black;" align="center" |250&deg;C / 500cycles


|style="background:WhiteSmoke; color:black" align="center"|<b><span style="color: red">0.1326</span></b>


{| {{table}}
|style="background:WhiteSmoke; color:black" align="center"|67.92
| align="center" |
{| border="2" cellspacing="2" cellpadding="3" align="center" style="width:750px"
! colspan="5" |Deposition conditions at 300 <sup>o</sup>C
|-
!Number of cycles
|<b>Thickness (nm)</b>
|<b>Uniformity across 100mm Si substrate (%)</b>
|<b>Standard deviation error</b>
|<b>Refractive index @ 632.8 nm</b>


|-
|style="background:WhiteSmoke; color:black" align="center"|1.71
|150
|15.59
|2.11
|0.24
|1.63


|-
|style="background:WhiteSmoke; color:black" align="center"|3.82
|300
|29.00
|0.79
|0.17
|1.65


|-  
|-  
|500
|}
|47.86
|1.71
|0.26
|1.64


|-  
<br>
|800
<!-- -->
|75.04
|0.90
|0.55
|1.65


|-
|1088
|101.76
|0.75
|0.62
|1.65


|-
|}




| align="center" valign="top"|
{| border="2" cellspacing="2" cellpadding="3" align="center" style="width:750px"
! colspan="5" |Deposition conditions at 350 <sup>o</sup>C
|-
!Number of cycles
|<b>Thickness (nm)</b>
|<b>Uniformity across 100mm Si substrate (%)</b>
|<b>Standard deviation error</b>
|<b>Refractive index @ 632.8 nm</b>


|-
<gallery caption="" widths="400px" heights="400px" perrow="3">
|150  
image:eves_SE_uniformity_ZnO_100C_ALD1_20220223.png|Uniformity across 100mm wafer. Deposition at 100&deg;C
|13.88
image:eves_SE_uniformity_ZnO_150C_ALD1_20220223.png|Uniformity across 100mm wafer. Deposition at 150&deg;C
|0.69
image:eves_SE_uniformity_ZnO_200C_ALD1_20220223.png|Uniformity across 100mm wafer. Deposition at 200&deg;C
|0.06
image:eves_SE_uniformity_ZnO_225C_ALD1_20220223.png|Uniformity across 100mm wafer. Deposition at 225&deg;C
|1.67
image:eves_SE_uniformity_ZnO_250C_ALD1_20220223.png|Uniformity across 100mm wafer. Deposition at 250&deg;C
</gallery>


|-
=Optical functions=
|300
|26.70
|0.62
|0.12
|1.64


|-
Results have been obtained for <100> 100 mm Si wafers with native oxide, based on [[Specific_Process_Knowledge/Characterization/Optical_characterization#Ellipsometer|ellipsometry]] study.
|500
|43.70
|0.42
|0.15
|1.64


|-
<gallery caption="" widths="400px" heights="400px" perrow="2">
|800
image:eves_ref_index_ZnO_ALD1_20220223.png|Refractive index.
|68.77
image:eves_abs_coeff_ZnO_ALD1_20220223.png|Absorption coefficient.
|0.65
</gallery>
|0.37
|1.65


|-
=SEM images=
|1088
|92.88
|0.70
|0.48
|1.66


|-
Images obtained using [[Specific Process Knowledge/Characterization/SEM: Scanning Electron Microscopy|SEM inspection]].
|}
|-
|}
|}


<br clear="all" />
<gallery caption="" widths="400px" heights="400px" perrow="3">
<b>Evgeniy Shkondin, DTU Danchip, 2014-2016.</b>
image:eves_SEM_ZnO_500cycles_100C_ALD1_20220223_convert.png|SEM image of flat surface of ZnO. Deposition at 100&deg;C
<br clear="all" />
image:eves_SEM_ZnO_500cycles_150C_ALD1_20220223_convert.png|SEM image of flat surface of ZnO. Deposition at 150&deg;C
<br clear="all" />
image:eves_SEM_ZnO_500cycles_200C_ALD1_20220223_convert.png|SEM image of flat surface of ZnO. Deposition at 200&deg;C
image:eves_SEM_ZnO_500cycles_225C_ALD1_20220223_convert.png|SEM image of flat surface of ZnO. Deposition at 225&deg;C
image:eves_SEM_ZnO_500cycles_250C_ALD1_20220223_convert.png|SEM image of flat surface of ZnO. Deposition at 250&deg;C
image:eves_SEM_ZnO_HARS_ALD1_20220223_convert.png|ZnO deposition example on high aspect ratio structures. "<b>ZnOT</b>" recipe was used.
</gallery>


===Al<sub>2</sub>O<sub>3</sub> XPS investigation for elemental trace analysis===
=ZnO XPS investigation for elemental trace analysis=


XPS profile for Al<sub>2</sub>O<sub>3</sub> has been obtained using [[Specific_Process_Knowledge/Characterization/XPS#XPS-ThermoScientific|XPS-ThermoScientific]]. Al<sub>2</sub>O<sub>3</sub> samples reveals chemically high quality films with no observable contaminations in temperature range 150 - 350 <sup>o</sup>C. At lower temperature (100 <sup>o</sup>C) the ALD reaction starts to become unsufficient and some amount of carbon from TMA precursor gets absorbed into the film.  
Chemical composition of ZnO has been analyzed by [[Specific_Process_Knowledge/Characterization/XPS|XPS method]]. ZnO samples reveals chemically high quality films with no observable contaminations in temperature range 100 - 250 <sup>o</sup>C.




<gallery caption="" widths="500px" heights="500px" perrow="3">
<gallery caption="" widths="600px" heights="600px" perrow="1">
image:Al2O3_XPS.jpg| Survey scan of Al<sub>2</sub>O<sub>3</sub>.
image:eves_ALD1_XPS_ZnO_20220223.png|XPS survey scan of ZnO.
image:LT_Al2O3_Carbon_content.JPG| <b>C 1s</b> scan of Al<sub>2</sub>O<sub>3</sub> film deposited at 100<sup>o</sup>C. Shows clearly carbon impurities in the film
image:HT_Al2O3_Carbon_content.JPG| <b>C 1s</b> scan of Al<sub>2</sub>O<sub>3</sub> film deposited between 150<sup>o</sup>C - 350<sup>o</sup>C. No carbon observes.
</gallery>
</gallery>
<br clear="all" />
<b>Evgeniy Shkondin, DTU Danchip, 2014-2016.</b>
<br clear="all" />
<br clear="all" />

Latest revision as of 13:07, 19 June 2023

Feedback to this page: click here

This page is written by DTU Nanolab internal



Obsolete - ZnO should now be deposited in ALD2


Deposition of ZnO is a standard, well-explored ALD process. Previously (before 2018), DEZ had its independent inlet (A1), which shared the same N2 line with the TiCl4 precursor (A2). The DEZ precursor bottle was placed in a cabinet behind the instrument in the service area, and a long pipe led the precursor to the ALD chamber. This option has been abandoned due to safety reasons. This line was very difficult to purge in case of service. The results that were obtained with the old hardware configuration now remain obsolete. Nowadays, if the user wants to deposit ZnO, in ALD-1 the diethyl zinc (DEZ) has to be mounted in the A-line. If TiCl4 is currently present it has to be exchanged with DEZ. This is a time-consuming job, that needs to be ordered and prepared in advance.

ZnO ALD deposition using DEZ and H2O

ZnO can be deposited in the range between 100 oC to 225 oC. It is not recommended to increase the temperature above 225oC, as the uniformity suffers due to the precursor decomposition. The maximum temperature can be 250oC, here however the film crystal quality, crystallinity, roughness, etc. sufficiently differ from the films prepared in a lower temperature range.


All results shown on this page have been obtained using the present (from 2018) configuration. Deposition and characterization has been performed in 2021 by Evgeniy Shkondin, DTU Nanolab

ZnO recipes

Recipe: ZnO

Maximum deposition thickness: 100 nm

Temperature: 100 oC - 250 oC

DEZ* H2O
Nitrogen flow 150 sccm 200 sccm
Pulse time 0.1 s 0.1 s
Purge time 5.0 s 5.0 s

This is a standard recipe of ZnO. It is suitable for coating the flat samples and structures with an aspect ratio of around up to 1:10.

Recipe: ZnOT

Maximum deposition thickness: 100 nm

Temperature: 100 oC - 250 oC

DEZ* DEZ H2O H2O
Nitrogen flow 150 sccm 150 sccm 200 sccm 200 sccm
Pulse time 0.1 s 0.1 s 0.1 s 0.1 s
Purge time 0.5 s 20.0 s 0.5 s 20.0 s


This is a more complicated recipe that allows coating the sample with very high aspect ratio profiles. One SEM example is shown on one of the images below. The recipe is good for deposition on very high aspect ratio structures (with aspect ratio more than 1:20) such as deep trenches, pillars, pores etc. ZnOT recipe can also be used for deposition on polymers at low temperatures (80-120 oC).


DEZ is diethylzinc Zn(CH2CH3)2 or ZnEt2

Deposition characteristics

The deposition rate for ZnO depends on the temperature, see the ALD-window graph below. The uniformity, thickness, refractive index has been obtained using Ellipsometer VASE.

Deposition rate

In the graphs below the ZnO thickness vs. number of cycles for deposition temperatures between 100 oC and 250 oC presented. Results have been obtained for <100> 100 mm Si wafers with native oxide, based on ellipsometry study. The optical model used in fitting is based on Tauc-Lorentz and two Lorentz oscillators.


Uniformity across 100 mm wafer

Recipe "ZnO" Samples: 100mm ssp-Si

Results have been obtained for <100> 100 mm Si wafers with native oxide, based on ellipsometry study.

Temperature (°C) / Number of cycles Deposition rate (nm/s) Average thickness (nm) Standard deviation Uniformity (%)
100°C / 500cycles 0.1483 75.67 1.49 3.26
150°C / 500cycles 0.1954 95.32 1.32 2.44
200°C / 500cycles 0.1842 87.97 0.31 0.63
225°C / 500cycles 0.1622 81.09 0.45 1.07
250°C / 500cycles 0.1326 67.92 1.71 3.82




Optical functions

Results have been obtained for <100> 100 mm Si wafers with native oxide, based on ellipsometry study.

SEM images

Images obtained using SEM inspection.

ZnO XPS investigation for elemental trace analysis

Chemical composition of ZnO has been analyzed by XPS method. ZnO samples reveals chemically high quality films with no observable contaminations in temperature range 100 - 250 oC.