Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420: Difference between revisions

From LabAdviser
← Older edit
VisualWikitext
Mdyma (talk | contribs)
danchip
584 edits
Reet (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab347-labadviser-users-35231
1,409 edits
 
(23 intermediate revisions by 5 users not shown)
Line 1: Line 1:
=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
'''Feedback to this page''': '''[mailto:characterization@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Characterization/KLA-Tencor_Surfscan_6420&action=edit&redlink=1 click here]'''


'''Feedback to this page''': '''[mailto:characterization@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://http://labadviser.danchip.dtu.dk/index.php?title=Specific_Process_Knowledge/Characterization/KLA-Tencor_Surfscan_6420&action=edit&redlink=1 click here]'''
''This page is written by DTU Nanolab  internal''
 
==<span style="color:Red">EXPIRED. The KLA-Tencor Surfscan 6420 has has been removed from the cleanroom in April 2023. It has been replaced with the [[Specific_Process_Knowledge/Characterization/Particle_Scanner_Takano|Particle Scanner Takano]] that can be used instead.</span>==


== KLA-Tencor Surfscan 6420 ==
== KLA-Tencor Surfscan 6420 ==


[[image:Surfscan_at_FAT.JPG|300x300px|right|thumb|The image is from the cleanroom at the place it was refurbish in California.]]
[[image:Surfscan_at_FAT.JPG|300x300px|right|thumb|The KLA-Tencor Surfscan (at the place in California where it was refurbished).]]
 
The KLA-Tencor is a surface analysis instrument for detecting, couting and sizing of particles, i.e. light point defects. A broad range of particles size from 0.15 µm to greater than 3 µm can be measured on a polished silicon surface with or without or epitaxial layers. The particle contamination in thin films like nitride, oxide and polymer or resist layers can also be inspected.
The system will remove small surface roughness, so it will not count as particle contaminations.
 
The system is mainly being used for quality control of the PECVDs and LPCVD nitride furnaces in the cleanroom.
 
Users will have to contact the responsible persons (the Thin Film group), if they want to make some particle measurements.


Particles counting of a unpatterned surface. A broad range of particles size from 0.1 µm to greater than 3 µm can be measured on a polished silicon or epitaxial layers. Thin films as e.g. Poly-si, Nitride and thermal Oxide can also be inspected. The system will remove small surface roughness so it not count as a particle.  
'''[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=318 Surfscan 6420]'''




'''The user manual(s), quality control procedure(s) and results, user APV(s), technical information and contact information can be found in LabManager:'''
== Process information ==
<!-- remember to remove the type of documents that are not present -->
 
*[[Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420/Acceptance test results|Acceptance test results]]


<!-- give the link to the equipment info page in LabManager: -->
[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=18 LabManager]


==Overview of the performance of the Surfscan 6420 and some process related parameters==
==Overview of the performance of the Surfscan 6420 and some process related parameters==


{| border="2" cellspacing="0" cellpadding="0"  
{| border="2" cellspacing="0" cellpadding="2"  
|-
|-
!style="background:silver; color:black;" align="center"|Purpose  
!style="background:silver; color:black;" align="center"|Purpose  
Line 24: Line 32:


|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Particles counting
*Detecting, counting and sizing of particles (light point defects)
|-
|-
!style="background:silver; color:black" align="center" rowspan="3"|Performance
!style="background:silver; color:black" align="center" rowspan="3"|Performance
|style="background:LightGrey; color:black"|Particles size
|style="background:LightGrey; color:black"|Particles size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*0.1 µm to 3 µm
*0.15 µm to > 3 µm
|-
|-
|style="background:LightGrey; color:black"|Througput
|style="background:LightGrey; color:black"|Througput
Line 37: Line 45:
|style="background:LightGrey; color:black"|Repeatbility
|style="background:LightGrey; color:black"|Repeatbility
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Within  1%, 1σ (mean count > 500, 0,204 µm diameter latex spheres)
*Within  1%, 1σ (mean count > 500, 0.204 µm diameter latex spheres)
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Process parameter range
!style="background:silver; color:black" align="center" valign="center" rowspan="1"|Process parameter range
|style="background:LightGrey; color:black"|Process Temperature
|style="background:LightGrey; color:black"|Process Temperature
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Room temperature
*Room temperature
|-
|style="background:LightGrey; color:black"|Process pressure
|style="background:WhiteSmoke; color:black"|
*1 atm
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
Line 53: Line 57:
*1-25 100 mm wafers  
*1-25 100 mm wafers  
*1-25 150 mm wafers
*1-25 150 mm wafers
*1-25 200 mm wafers (the loader has to be changed)
|-
|-
| style="background:LightGrey; color:black"|Substrate material allowed
|style="background:LightGrey; color:black"|Substrate materials allowed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
 
*Silicon
*Thin layers of oxide, nitride and polymer/resist
|-  
|-  
|}
|}

Latest revision as of 13:58, 13 June 2023

Feedback to this page: click here

This page is written by DTU Nanolab internal

EXPIRED. The KLA-Tencor Surfscan 6420 has has been removed from the cleanroom in April 2023. It has been replaced with the Particle Scanner Takano that can be used instead.

KLA-Tencor Surfscan 6420

The KLA-Tencor Surfscan (at the place in California where it was refurbished).

The KLA-Tencor is a surface analysis instrument for detecting, couting and sizing of particles, i.e. light point defects. A broad range of particles size from 0.15 µm to greater than 3 µm can be measured on a polished silicon surface with or without or epitaxial layers. The particle contamination in thin films like nitride, oxide and polymer or resist layers can also be inspected. The system will remove small surface roughness, so it will not count as particle contaminations.

The system is mainly being used for quality control of the PECVDs and LPCVD nitride furnaces in the cleanroom.

Users will have to contact the responsible persons (the Thin Film group), if they want to make some particle measurements.

Surfscan 6420


Process information


Overview of the performance of the Surfscan 6420 and some process related parameters

Purpose
  • Detecting, counting and sizing of particles (light point defects)
Performance Particles size
  • 0.15 µm to > 3 µm
Througput
  • Up to 100 wafer per hour (200 mm)
Repeatbility
  • Within 1%, 1σ (mean count > 500, 0.204 µm diameter latex spheres)
Process parameter range Process Temperature
  • Room temperature
Substrates Batch size
  • 1-25 100 mm wafers
  • 1-25 150 mm wafers
  • 1-25 200 mm wafers (the loader has to be changed)
Substrate materials allowed
  • Silicon
  • Thin layers of oxide, nitride and polymer/resist
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Characterization/KLA-Tencor_Surfscan_6420&oldid=46545"