Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420: Difference between revisions

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''This page is written by DTU Nanolab  internal''
==<span style="color:Red">EXPIRED. The KLA-Tencor Surfscan 6420 has has been removed from the cleanroom in April 2023. It has been replaced with the [[Specific_Process_Knowledge/Characterization/Particle_Scanner_Takano|Particle Scanner Takano]] that can be used instead.</span>==


== KLA-Tencor Surfscan 6420 ==
== KLA-Tencor Surfscan 6420 ==


[[image:Surfscan_at_FAT.JPG|300x300px|right|thumb|The image is from the cleanroom at the place it was refurbish in California.]]
[[image:Surfscan_at_FAT.JPG|300x300px|right|thumb|The KLA-Tencor Surfscan (at the place in California where it was refurbished).]]


The KLA-Tencor is a surface analysis instrument for detecting, couting and sizing of particles, i.e. light point defects. A broad range of particles size from 0.15 µm to greater than 3 µm can be measured on a polished silicon surface with or without or epitaxial layers. The particle contamination in thin films like nitride, thermal oxide and polymer or resist can also be inspected. The system will remove small surface roughness so it will not count as particle contaminations.  
The KLA-Tencor is a surface analysis instrument for detecting, couting and sizing of particles, i.e. light point defects. A broad range of particles size from 0.15 µm to greater than 3 µm can be measured on a polished silicon surface with or without or epitaxial layers. The particle contamination in thin films like nitride, oxide and polymer or resist layers can also be inspected.  
The system will remove small surface roughness, so it will not count as particle contaminations.  


'''The user manual and contact information can be found in LabManager:'''
The system is mainly being used for quality control of the PECVDs and LPCVD nitride furnaces in the cleanroom.
 
Users will have to contact the responsible persons (the Thin Film group), if they want to make some particle measurements.


'''[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=318 Surfscan 6420]'''
'''[http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=318 Surfscan 6420]'''


== Process information ==
== Process information ==


*[[Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420/Acceptance test results|Acceptance test results]]
*[[Specific Process Knowledge/Characterization/KLA-Tencor Surfscan 6420/Acceptance test results|Acceptance test results]]


==Overview of the performance of the Surfscan 6420 and some process related parameters==
==Overview of the performance of the Surfscan 6420 and some process related parameters==
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*1-25 100 mm wafers  
*1-25 100 mm wafers  
*1-25 150 mm wafers
*1-25 150 mm wafers
*1-25 200 mm wafers (loader has to be changed)
*1-25 200 mm wafers (the loader has to be changed)
|-
|-
|style="background:LightGrey; color:black"|Substrate materials allowed
|style="background:LightGrey; color:black"|Substrate materials allowed

Latest revision as of 14:58, 13 June 2023

Feedback to this page: click here

This page is written by DTU Nanolab internal

EXPIRED. The KLA-Tencor Surfscan 6420 has has been removed from the cleanroom in April 2023. It has been replaced with the Particle Scanner Takano that can be used instead.

KLA-Tencor Surfscan 6420

The KLA-Tencor Surfscan (at the place in California where it was refurbished).

The KLA-Tencor is a surface analysis instrument for detecting, couting and sizing of particles, i.e. light point defects. A broad range of particles size from 0.15 µm to greater than 3 µm can be measured on a polished silicon surface with or without or epitaxial layers. The particle contamination in thin films like nitride, oxide and polymer or resist layers can also be inspected. The system will remove small surface roughness, so it will not count as particle contaminations.

The system is mainly being used for quality control of the PECVDs and LPCVD nitride furnaces in the cleanroom.

Users will have to contact the responsible persons (the Thin Film group), if they want to make some particle measurements.

Surfscan 6420


Process information


Overview of the performance of the Surfscan 6420 and some process related parameters

Purpose
  • Detecting, counting and sizing of particles (light point defects)
Performance Particles size
  • 0.15 µm to > 3 µm
Througput
  • Up to 100 wafer per hour (200 mm)
Repeatbility
  • Within 1%, 1σ (mean count > 500, 0.204 µm diameter latex spheres)
Process parameter range Process Temperature
  • Room temperature
Substrates Batch size
  • 1-25 100 mm wafers
  • 1-25 150 mm wafers
  • 1-25 200 mm wafers (the loader has to be changed)
Substrate materials allowed
  • Silicon
  • Thin layers of oxide, nitride and polymer/resist
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