Specific Process Knowledge/Thin film deposition/Deposition of Tin: Difference between revisions
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{| border="1" cellspacing="0" cellpadding=" | == Tin deposition == | ||
Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has not yet been evaporated in the Temescal e-beam evaporator which we have now (June 2023). Please contact the Thin Film group if you would like to deposit tin. | |||
{| border="1" cellspacing="0" cellpadding="3" | |||
|-style="background:silver; color:black" | |||
! | ! | ||
! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/ | ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]]) | ||
|- | |- | ||
| | |-style="background:WhiteSmoke; color:black" | ||
| | ! General description | ||
| E-beam deposition of Sn | |||
(line-of-sight deposition) | |||
|- | |||
|-style="background:LightGrey; color:black" | |||
!Pre-clean | |||
|Ar ion clean | |||
|- | |- | ||
| | |-style="background:WhiteSmoke; color:black" | ||
| | !Layer thickness | ||
|10Å to 1µm* | |||
|- | |- | ||
| | |-style="background:LightGrey; color:black" | ||
|10Å | ! Deposition rate | ||
|1Å/s to 10Å/s | |||
|- | |- | ||
| | |||
| | |||
|-style="background:WhiteSmoke; color:black" | |||
!Pre-clean | |||
|Ar ion bombardment | |||
|-style="background:LightGrey; color:black" | |||
! Batch size | |||
| | |||
*Up to 4x6" wafers | |||
*Up to 3x8" wafers (ask for holder) | |||
*small pieces | |||
|- | |- | ||
|-style="background:WhiteSmoke; color:black" | |||
!Allowed materials | |||
| | |||
* Silicon | |||
*Silicon oxide | |||
*Silicon (oxy)nitride | |||
*Photoresist | |||
*PMMA | |||
*Mylar | |||
*Metals | |||
*See also the [http://labmanager.dtu.dk/function.php?module=XcMachineaction&view=edit&MachID=429 cross-contamination sheet] | |||
|-style="background:LightGrey; color:black" | |||
! Comment | |||
| Tin has not yet been deposited in the Temescal to date (May 2022). | |||
Please contact the Thin Film group if you would like us to develop the process. | |||
|} | |} | ||
'''*''' ''For thicknesses above 600 nm permission is required.'' | |||
Latest revision as of 12:14, 13 June 2023
Feedback to this page: click here
Unless otherwise stated, this page is written by DTU Nanolab internal
Tin deposition
Tin can be deposited by e-beam evaporation. It was evaporated in the Alcatel e-beam evaporator, which is decommissioned, but has not yet been evaporated in the Temescal e-beam evaporator which we have now (June 2023). Please contact the Thin Film group if you would like to deposit tin.
| E-beam evaporation (Temescal) | |
|---|---|
| General description | E-beam deposition of Sn
(line-of-sight deposition) |
| Pre-clean | Ar ion clean |
| Layer thickness | 10Å to 1µm* |
| Deposition rate | 1Å/s to 10Å/s |
| Pre-clean | Ar ion bombardment |
| Batch size |
|
| Allowed materials |
|
| Comment | Tin has not yet been deposited in the Temescal to date (May 2022).
Please contact the Thin Film group if you would like us to develop the process. |
* For thicknesses above 600 nm permission is required.