Specific Process Knowledge/Thin film deposition/Deposition of Molybdenum: Difference between revisions

Latest revision as of 10:48, 9 June 2023

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Molybdenum deposition

Molybdenum can be deposited by e-beam evaporation or sputtering. In the chart below you can compare the different deposition equipment.

	E-beam evaporation (Temescal)	Sputter deposition (Lesker)	Sputter deposition (Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3))
General description	E-beam deposition of Mo (line-of-sight deposition)	Sputter deposition of Mo (not line-of-sight)	Sputter deposition of Mo (not line-of-sight)
Pre-clean	Ar ion source	RF Ar clean	RF Ar clean
Layer thickness	10Å to 0.2 µm*	10Å to 500 Å	10Å to ? discuss with staff
Deposition rate	1Å/s to 10Å/s	Depends on process parameters, roughly about 1 Å/s	Not known yet, probably similar to 'old' Lesker sputter system
Batch size	Up to 4x6" wafers Up to 3x8" wafers (ask for holder) Many smaller pieces	Pieces or 1x4" wafer or 1x6" wafer	Up to 10x4" or 6" wafers Many smaller pieces
Allowed materials	Silicon Silicon oxide Silicon (oxy)nitride Photoresist PMMA Mylar Metals See also the cross-contamination sheet	Silicon Silicon oxide Silicon nitride Silicon (oxy)nitride Photoresist PMMA Mylar SU-8	Almost any as long as it does not outgas.
Comment	As of June 2023, Mo has not yet been deposited in the Temescal. Please contact the Thin Film group to develop a process.	Sputter target size 2".	Sputter target size 3-4" (usually 3"). As of June 2023, Mo has not yet been deposited in the 'new' Lesker sputter chambers. Please contact the Thin Film group to develop a process.

* Depending on the amount of heating during Mo deposition, which we will discover during process development.

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 '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php?title=Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_Molybdenum click here]'''
+<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>
 == Molybdenum deposition ==
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 ! E-beam evaporation ([[Specific Process Knowledge/Thin film deposition/Temescal|Temescal]])
 ! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Lesker|Lesker]])
+! Sputter deposition ([[Specific Process Knowledge/Thin film deposition/Cluster-based multi-chamber high vacuum sputtering deposition system|Sputter-system Metal-Oxide (PC1) and Sputter-system Metal-Nitride (PC3)]])
 |-
 |-style="background:WhiteSmoke; color:black"
@@ Line 16: / Line 17: @@
 | E-beam deposition of Mo
 (line-of-sight deposition)
+| Sputter deposition of Mo
+(not line-of-sight)
 | Sputter deposition of Mo
 (not line-of-sight)
@@ Line 22: / Line 25: @@
 ! Pre-clean
 |Ar ion source
+|RF Ar clean
 |RF Ar clean
 |-
@@ Line 28: / Line 32: @@
 |10Å to 0.2 µm*
 |10Å to 500 Å
+|10Å to ? ''discuss with staff''
 |-
 |-style="background:LightGrey; color:black"
@@ Line 33: / Line 38: @@
 |1Å/s to 10Å/s
 | Depends on process parameters, roughly about 1 Å/s
+| Not known yet, probably similar to 'old' Lesker sputter system
 |-
 |-
@@ Line 45: / Line 51: @@
 * 1x4" wafer or
 * 1x6" wafer
+|
+*Up to 10x4" or 6" wafers
+*Many smaller pieces
 |-
@@ Line 68: / Line 77: @@
 * Mylar
 * SU-8
+|
+Almost any as long as it does not outgas.
 |-style="background:WhiteSmoke; color:black"
 ! Comment
-| As of August 2018, Mo has not yet been deposited in the Temescal.
+| As of June 2023, Mo has not yet been deposited in the Temescal.
+Please contact the Thin Film group to develop a process.
+| Sputter target size 2".
+| Sputter target size 3-4" (usually 3"). As of June 2023, Mo has not yet been deposited in the 'new' Lesker sputter chambers.
 Please contact the Thin Film group to develop a process.
-|
 |-