Specific Process Knowledge/Thin film deposition/Deposition of TiW: Difference between revisions
No edit summary |
|||
| (One intermediate revision by one other user not shown) | |||
| Line 1: | Line 1: | ||
'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW click here]''' | '''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Thin_film_deposition/Deposition_of_TiW click here]''' | ||
<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i> | |||
==Sputtering of TiW== | ==Sputtering of TiW== | ||
| Line 20: | Line 22: | ||
|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Pre-clean | ! Pre-clean | ||
|RF Ar clean | |RF Ar clean (not working at the moment (sept 2022)) | ||
|- | |- | ||
Latest revision as of 14:04, 6 June 2023
Feedback to this page: click here
Unless otherwise stated, this page is written by DTU Nanolab internal
Sputtering of TiW
Deposition of TiW alloy can be done in the Wordentec. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).
- Sputtering of TiW in Wordentec
- Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec
| Sputter deposition (Wordentec) | |
|---|---|
| General description | Sputter deposition of TiW |
| Pre-clean | RF Ar clean (not working at the moment (sept 2022)) |
| Layer thickness | . |
| Deposition rate | Depending on process parameters, see here. |
| Batch size |
|
| Allowed substrates |
|
| Allowed materials |
|
| Comments | TiW alloy: 10%/90% by weight |