Specific Process Knowledge/Thin film deposition/Deposition of TiW: Difference between revisions
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==Sputtering of TiW== | ==Sputtering of TiW== | ||
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Deposition of TiW alloy can be done in the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this). | Deposition of TiW alloy can be done in the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this). | ||
* [[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]] | *[[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]] | ||
*[[Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers|Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec]] | |||
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|-style="background:LightGrey; color:black" | |-style="background:LightGrey; color:black" | ||
! Pre-clean | ! Pre-clean | ||
|RF Ar clean | |RF Ar clean (not working at the moment (sept 2022)) | ||
|- | |- | ||
Latest revision as of 14:04, 6 June 2023
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Unless otherwise stated, this page is written by DTU Nanolab internal
Sputtering of TiW
Deposition of TiW alloy can be done in the Wordentec. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).
- Sputtering of TiW in Wordentec
- Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec
| Sputter deposition (Wordentec) | |
|---|---|
| General description | Sputter deposition of TiW |
| Pre-clean | RF Ar clean (not working at the moment (sept 2022)) |
| Layer thickness | . |
| Deposition rate | Depending on process parameters, see here. |
| Batch size |
|
| Allowed substrates |
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| Allowed materials |
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| Comments | TiW alloy: 10%/90% by weight |