Specific Process Knowledge/Thin film deposition/Deposition of TiW: Difference between revisions

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Deposition of TiW alloy can be done in the Wordentec.
 


<i> Unless otherwise stated, this page is written by <b>DTU Nanolab internal</b></i>


==Sputtering of TiW==
==Sputtering of TiW==


* [[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]]
Deposition of TiW alloy can be done in the [[Specific Process Knowledge/Thin film deposition/Wordentec|Wordentec]]. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).


*[[/Sputtering of TiW in Wordentec|Sputtering of TiW in Wordentec]]
*[[Specific Process Knowledge/Thin film deposition/Deposition of TiW/Sputtering of TiW in Wordentec/Grain size and uniformity of TiW layers|Results of a study on the grain size and uniformity of TiW sputtered in the Wordentec]]




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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
! Pre-clean
! Pre-clean
|RF Ar clean
|RF Ar clean (not working at the moment (sept 2022))
|-
|-


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| TiW alloy: 10%/90% by weight
| TiW alloy: 10%/90% by weight
|}
|}
'''Deposited rates'''
This is done by a sputtering process. Process parameters (argon pressure and effect) can be varied, the surface roughness and the deposition rate (see [[/Sputtering of TiW in Wordentec|here]]) and may change with these settings.
'''Deposited film characteristics'''
AFM pictures show how the surface roughness is dependent of the process parameters, this can be seen here.

Latest revision as of 14:04, 6 June 2023

Feedback to this page: click here

Unless otherwise stated, this page is written by DTU Nanolab internal

Sputtering of TiW

Deposition of TiW alloy can be done in the Wordentec. If necessary, processes may also be developed for depositing TiW in the Lesker sputter setups (contact responsible staff for this).


Sputter deposition (Wordentec)
General description Sputter deposition of TiW
Pre-clean RF Ar clean (not working at the moment (sept 2022))
Layer thickness .
Deposition rate Depending on process parameters, see here.
Batch size
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
Allowed substrates
  • Silicon wafers
  • Quartz wafers
  • Pyrex wafers
Allowed materials
  • Silicon oxide
  • Silicon (oxy)nitride
  • Photoresist
  • PMMA
  • Mylar
  • SU-8
  • Metals
Comments TiW alloy: 10%/90% by weight
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