Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using ASE/ICP recipe for SiO2: Difference between revisions
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====Results when etching a patterned wafer ==== | ====Results when etching a patterned wafer ==== | ||
{| border="2" cellspacing="2" cellpadding=" | {| border="2" cellspacing="2" cellpadding="2" | ||
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!Material to be etched | !Material to be etched |
Revision as of 09:44, 24 May 2023
This recipe was taken from the ICP Metal etch, with a slight difference in the platen temperature.
Parameter | Recipe name: SiO2_ICP |
---|---|
Coil Power [W] | 1000 |
Platen Power [W] | 200 |
Platen temperature [oC] | 20 |
C4F8 flow [sccm] | 10 |
H2 flow [sccm] | 28 |
Pressure [mTorr] | 2.5 |
Results when etching a patterned wafer