Specific Process Knowledge/Back-end processing/Polishing machine: Difference between revisions

← Older edit

VisualWikitext

Latest revision as of 14:24, 28 February 2023

Feedback to this page: click here

Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

All links Labmanager requires login.

Polisher/Lapper

The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.

The user manual, user APV, technical information and contact information can be found in LabManager:

The Logitech PM5 Polisher/Lapper in LabManager

Equipment performance and process related parameters

Equipment		Polisher/Lapper
Purpose	Thinning of substrates of	InP GaAs Silicon Metals Glass/Quartz
Performance	Thinning	Removal rate: 1-10µm/min Thickness accuracy: +/- 10 µm Thickness homogeneity: +/- 10 µm Roughness: +/- ? µm
Performance	Polishing	Removal rate: ~1 µm/min Thickness accuracy: ? µm Thickness homogeneity: ? µm Roughness: +/- ? µm
Process parameter range	Polishing liquid	Al2O3 (alumina) powder: 3, 9 or 20 µm Chemlox (for polishing) SF1 Polishing Fluid (for polishing e.g. SiO2)
	Polishing cloths	Chemcloth Polishing Cloths (for use with SF1 liquid)
	Rotation speed	Thinning: 5-20 rpm Polishing: 5-80 rpm
	Arm sweep	Thinning: stationary Polishing: 12% (inner) - 80% (outer)
Substrates	Batch size	# small samples one 50 mm wafer one 100 mm wafer
	Allowed materials	InP GaAs Silicon Metals Glass/Quartz

@@ Line 2: / Line 2: @@
 <!-- Replace "http://labadviser.danchip.dtu.dk/..." wih the link to the Labadviser page-->
-== Polisher/Lapper [[Image:section under construction.jpg|70px]] ==
+'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''
-[[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]]
+'''All links Labmanager requires login.'''
+== Polisher/Lapper ==
+<!-- copyright issue rkc -->
+<!-- copyright issue rkc [[image:Logitech pm5 1.jpg|400px|right|thumb|The Logitech PM5 Polisher/Lapper]]
+Training is required before using th machine. The machine is equipped with a LabManager lock.-->
 The Logitech PM5 Polisher/Lapper is for thinning down wafers and other substrates.
-'''The user manual, user APV(s), technical information and contact information can be found in LabManager:'''
+'''The user manual, user APV, technical information and contact information can be found in LabManager:'''
 <!-- remember to remove the type of documents that are not present -->
@@ Line 16: / Line 22: @@
 ==Equipment performance and process related parameters==
+[[File:IMG_20230228_113121.jpg|thumb|350px|PM5 lapper in Fume hood]]
 {| border="2" cellspacing="0" cellpadding="2"
 !colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment
 |style="background:WhiteSmoke; color:black"|<b>Polisher/Lapper</b>
-|style="background:WhiteSmoke; color:black"|<b>Equipment 2</b>
+<!-- |style="background:WhiteSmoke; color:black"|<b>Equipment 2</b> -->
 |-
 !style="background:silver; color:black;" align="center" width="60"|Purpose
@@ Line 31: / Line 38: @@
 *Metals
 *Glass/Quartz
-|style="background:WhiteSmoke; color:black"|
+<!-- |style="background:WhiteSmoke; color:black"|
 *Purpose 1
 *Purpose 2
-*Purpose 3
+*Purpose 3 -->
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="2"|Performance
@@ Line 43: / Line 50: @@
 *Thickness homogeneity: +/- 10 µm
 *Roughness: +/- ? µm
-|style="background:WhiteSmoke; color:black"|
+<!-- |style="background:WhiteSmoke; color:black"|
 *Performance range 1
 *Performance range 2
-*Performance range 3
+*Performance range 3 -->
 |-
 |style="background:LightGrey; color:black"|Polishing
@@ Line 54: / Line 61: @@
 *Thickness homogeneity: ? µm
 *Roughness: +/- ? µm
-|style="background:WhiteSmoke; color:black"|
+<!-- |style="background:WhiteSmoke; color:black"|
-*Performance range
+*Performance range -->
 |-
-!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Process parameter range
+!style="background:silver; color:black" align="center" valign="center" rowspan="4"|Process parameter range
 |style="background:LightGrey; color:black"|Polishing liquid
 |style="background:WhiteSmoke; color:black"|
 *Al2O3 (alumina) powder: 3, 9 or 20 µm
 *Chemlox (for polishing)
+*SF1 Polishing Fluid (for polishing e.g. SiO2)
+|-
+|style="background:LightGrey; color:black"|Polishing cloths
 |style="background:WhiteSmoke; color:black"|
-*Range
+*Chemcloth Polishing Cloths (for use with SF1 liquid)
 |-
 |style="background:LightGrey; color:black"|Rotation speed
@@ Line 69: / Line 79: @@
 *Thinning: 5-20 rpm
 *Polishing: 5-80 rpm
-|style="background:WhiteSmoke; color:black"|
-*Range
 |-
 |style="background:LightGrey; color:black"|Arm sweep
@@ Line 76: / Line 84: @@
 *Thinning: stationary
 *Polishing: 12% (inner) - 80% (outer)
-|style="background:WhiteSmoke; color:black"|
-*Range
 |-
 !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
@@ Line 83: / Line 89: @@
 |style="background:WhiteSmoke; color:black"|
 *<nowiki>#</nowiki> small samples
-*<nowiki>#</nowiki> 50 mm wafers
+*one 50 mm wafer
-*<nowiki>#</nowiki> 100 mm wafers
+*one 100 mm wafer
-|style="background:WhiteSmoke; color:black"|
+<!-- |style="background:WhiteSmoke; color:black"|
 *<nowiki>#</nowiki> small samples
 *<nowiki>#</nowiki> 50 mm wafers
 *<nowiki>#</nowiki> 100 mm wafers
-*<nowiki>#</nowiki> 150 mm wafers
+*<nowiki>#</nowiki> 150 mm wafers -->
 |-
 | style="background:LightGrey; color:black"|Allowed materials
@@ Line 98: / Line 104: @@
 *Metals
 *Glass/Quartz
-|style="background:WhiteSmoke; color:black"|
+<!-- |style="background:WhiteSmoke; color:black"|
 *Allowed material 1
 *Allowed material 2
-*Allowed material 3
+*Allowed material 3 -->
 |-
 |}
+[[File:IMG_20230228_113134.jpg|thumb|left|300px|lapping jig]]
+[[File:IMG_20230228_113127.jpg|thumb|1000px|mounting/measuring space]]
 <br clear="all" />