Specific Process Knowledge/Characterization/Thickness Measurer: Difference between revisions

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=<span style="background:#FF2800">THIS PAGE IS UNDER CONSTRUCTION</span>[[image:Under_construction.png|200px]]=
'''Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.'''


'''All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.'''


'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Thickness_Measurer click here]'''  
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Thickness_Measurer click here]'''  


==Thickness measurer==
==Thickness measurer==
[[Image:??.jpg|thumb|300x300px|Thickness meassurer. Positioned in cleanroom 4]]
[[Image:Thicknessmeasurer2007.jpg|thumb|300x300px|Thickness Measurer. Positioned in cleanroom D-3]]


The purpose is to measure the thickness of wafers, depths of larger grooves or height of larger mesas.  
There are 2 thickness measurers in the cleanroom, both positioned in cleanroom D-3. The Thickness measurer is for measuring all sorts of samples. The thickness measurer (wafers) is solely for measuring the thickness of wafers or depths of grooves on wafers.
 
During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.  


Doing a KOH etch can it be helpful to insure no over etching by making a thickness measurement doing the etch.


'''The user manual, technical information and contact information can be found in LabManager:'''
'''The user manual, technical information and contact information can be found in LabManager:'''


'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=198 Thickness measurer]'''
'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=198 Thickness measurer]'''
 
'''[http://www.labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=447 Thickness measurer (wafers)]'''
==Process knowledge==


==Quality Control - Recipe Parameters and Limits==
==Quality Control - Recipe Parameters and Limits==
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|bgcolor="#98FB98" |'''Quality Control (QC) for the Thickness measurer'''
|bgcolor="#98FB98" |'''Quality Control (QC) for the Thickness measurer'''
|-
|-
|
|  
The measured standard thickness is 0.1 mm. The measured result has to be within &plusmn; 0.005 mm. The QC is preformed once a year.
*[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=198 The QC procedure]<br>
*[http://www.labmanager.danchip.dtu.dk/d4Show.php?id=1831&mach=198 The QC procedure]<br>
*[http://www.labmanager.danchip.dtu.dk/view_binary.php?fileId=2062 The newest QC data]<br>
*[https://labmanager.dtu.dk/view_binary.php?type=data&mach=198 The newest QC data]<br>
|}


The measured standard is 0.1 mm. The measured result have to be within +- 0.005 mm. The QC is preformed ones a year.
==Equipment performance and process related parameters==


==Equipment performance and process related parameters==
{| border="2" cellspacing="2" cellpadding="3"


{| border="2" cellspacing="2" cellpadding="0"
|-
|-
!style="background:silver; color:black;" align="center"|
!style="background:silver; color:black;" align="center"|
Purpose  
Purpose  
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
Measurer the thinkness of silicon wafer
Thickness measurer
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
??
*Wafer thickness
*Depths of larger grooves
*Heigth of larger samples
|-
|-
!style="background:silver; color:black" align="center"|
!style="background:silver; color:black" align="center"|
Performance
Performance
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
??
Thickness resolution
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
??
*< 1 µm
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|
Process parameter range
Substrates
|style="background:LightGrey; color:black"|
|style="background:LightGrey; color:black"|
Process Temperature
Batch size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*800-1150 <sup>o</sup>C
*One sample
|-
|-
|style="background:LightGrey; color:black"|Process pressure
| style="background:LightGrey; color:black"|Substrate materials allowed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1 atm
*No restrictions
|-
|}
 
 
 
 
{| border="2" cellspacing="2" cellpadding="3"
 
|-
|-
|style="background:LightGrey; color:black"|Gasses on the system
!style="background:silver; color:black;" align="center"|
Purpose
|style="background:LightGrey; color:black"|
Thickness measurer (wafers)
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
 
*Wafer thickness
*Depths of larger grooves
|-
!style="background:silver; color:black" align="center"|
Performance
|style="background:LightGrey; color:black"|
Thickness resolution
|style="background:WhiteSmoke; color:black"|
*< 1 µm
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|Substrates
!style="background:silver; color:black" align="center" valign="center" rowspan="2"|
|style="background:LightGrey; color:black"|Batch size
Substrates
|style="background:LightGrey; color:black"|
Batch size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1-30 100 mm wafers (or 50 mm wafers) per run
*One sample
|-
|-
| style="background:LightGrey; color:black"|Substrate materials allowed
| style="background:LightGrey; color:black"|Substrate materials allowed
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Silicon wafers (RCA cleaned) without metal bulk contamination
*Only wafers  
|-  
|-  
|}
|}
'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Characterization/Thickness_Measurer click here]'''
This is a micrometer-screw.
[[image:Mikrometerskrue_hel_a.JPG|200x200px|right|thumb|The Thickness measurer in Cleanroom 3 ]]
It measures with an accurracy within a few µm.
The range is from a few µm up to 5mm.
Measure the wafer in the box next to the meter. If this is ok, then other wafers can be measured.
There is a calibration device by the DEKTAK.
It is calibrated at 750µm.

Latest revision as of 15:31, 6 February 2023

Unless anything else is stated, everything on this page, text and pictures are made by DTU Nanolab.

All links to Kemibrug (SDS) and Labmanager Including APV and QC requires login.

Feedback to this page: click here

Thickness measurer

Thickness Measurer. Positioned in cleanroom D-3

There are 2 thickness measurers in the cleanroom, both positioned in cleanroom D-3. The Thickness measurer is for measuring all sorts of samples. The thickness measurer (wafers) is solely for measuring the thickness of wafers or depths of grooves on wafers.

During a KOH etch it can be helpful to ensure no over-etching by making a thickness measurement during the etching.


The user manual, technical information and contact information can be found in LabManager:

Thickness measurer Thickness measurer (wafers)

Quality Control - Recipe Parameters and Limits

Quality Control (QC) for the Thickness measurer

The measured standard thickness is 0.1 mm. The measured result has to be within ± 0.005 mm. The QC is preformed once a year.

Equipment performance and process related parameters

Purpose

Thickness measurer

  • Wafer thickness
  • Depths of larger grooves
  • Heigth of larger samples

Performance

Thickness resolution

  • < 1 µm

Substrates

Batch size

  • One sample
Substrate materials allowed
  • No restrictions



Purpose

Thickness measurer (wafers)

  • Wafer thickness
  • Depths of larger grooves

Performance

Thickness resolution

  • < 1 µm

Substrates

Batch size

  • One sample
Substrate materials allowed
  • Only wafers
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