Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessD/PrD02: Difference between revisions
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<!--Checked for updates on 11/2-2019 - ok/jmli --> | |||
<!-- Page reviewed 9/8-2022 jmli --> | |||
<!--Checked for updates on 6/5-2023 - ok/jmli --> | |||
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{| border="2" cellpadding="0" cellspacing="0" style="text-align:center;" | {| border="2" cellpadding="0" cellspacing="0" style="text-align:center;" | ||
|+ '''Process runs''' | |+ '''Process runs''' | ||
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| Pegasus/jmli | | Pegasus/jmli | ||
| 10 minute TDESC clean | | 10 minute TDESC clean | ||
| | | nanolab/jml/showerhead/prD/PrD02, 110 cyc or 6:25 mins | ||
| S004693 | | S004693 | ||
! New showerhead | ! New showerhead | ||
Latest revision as of 12:40, 6 February 2023
Unless otherwise stated, all content on this page was created by Jonas Michael-Lindhard, DTU Nanolab
| Date | Substrate Information | Process Information | SEM Images | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Wafer info | Mask | Material/ Exposed area | Tool / Operator | Conditioning | Recipe | Wafer ID | Comments | ||
| 2/12-2014 | 4" Wafer with travka50 mask | AZ standard | Si / 50 % | Pegasus/jmli | 10 minute TDESC clean | nanolab/jml/showerhead/prD/PrD02, 110 cyc or 6:25 mins | S004693 | New showerhead |
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