Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessD/PrD02: Difference between revisions

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| 4" Wafer with travka50 mask
| 4" Wafer with travka50 mask
| AZ standard  
| AZ standard  
| Si / 50+ %  
| Si / 50 %  
| Pegasus/jmli
| Pegasus/jmli
| 10 minute TDESC clean
| 10 minute TDESC clean
| danchip/jml/showerhead/prD/PrD01, 110 cyc or 6:14 mins
| nanolab/jml/showerhead/prD/PrD02, 110 cyc or 6:25 mins
| S004691
| S004693
! New showerhead  
! New showerhead  
|  
|  
 
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Latest revision as of 12:40, 6 February 2023


Unless otherwise stated, all content on this page was created by Jonas Michael-Lindhard, DTU Nanolab


Process runs
Date Substrate Information Process Information SEM Images
Wafer info Mask Material/ Exposed area Tool / Operator Conditioning Recipe Wafer ID Comments
2/12-2014 4" Wafer with travka50 mask AZ standard Si / 50 % Pegasus/jmli 10 minute TDESC clean nanolab/jml/showerhead/prD/PrD02, 110 cyc or 6:25 mins S004693 New showerhead

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