Specific Process Knowledge/Lithography/Coaters/GammaUV: Difference between revisions
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The system handles 4" and 6" wafers without size conversion, and can be set up to handle 2" or 8". | The system handles 4" and 6" wafers without size conversion, and can be set up to handle 2" or 8". | ||
The coater is equipped with 3 different | The coater is equipped with 3 different resist lines, as well as 1 syringe line: | ||
*AZ MiR 701 | *AZ MiR 701 | ||
*AZ nLOF 2020 | *AZ nLOF 2020 | ||
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'''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]''' | '''[https://www.youtube.com/watch?v=3JhM3rmLVpA Training video]''' | ||
The user manual, quality control procedures and results, user APVs, and contact information can be found in [http://labmanager.dtu.dk/function.php?module=Machine&view=view&mach=359 LabManager] - '''requires login''' | |||
===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma UV processing|Process information]]=== | ===[[Specific Process Knowledge/Lithography/Coaters/Spin Coater: Gamma UV processing|Process information]]=== | ||
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=== Equipment performance and process related parameters === | === Equipment performance and process related parameters === | ||
{| border=" | {|border="1" cellspacing="1" cellpadding="10" style="text-align:left;" | ||
!style="background:silver; color:black;" align="center" width="60"|Purpose | !style="background:silver; color:black;" align="center" width="60"|Purpose | ||
|style="background:LightGrey; color:black"| | |style="background:LightGrey; color:black"| | ||
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|style="background:LightGrey; color:black"|HMDS contact angle | |style="background:LightGrey; color:black"|HMDS contact angle | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
60 - 80° | 60 - 80° | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Coating thickness | |style="background:LightGrey; color:black"|Coating thickness | ||
Line 59: | Line 59: | ||
|style="background:LightGrey; color:black"|Priming temperature | |style="background:LightGrey; color:black"|Priming temperature | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
120 °C | 120 °C | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Spin speed | |style="background:LightGrey; color:black"|Spin speed | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
10 - 6000 rpm | 10 - 6000 rpm | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Spin acceleration | |style="background:LightGrey; color:black"|Spin acceleration | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
10 - 10000 rpm/s | 10 - 10000 rpm/s | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Hotplate temperature | |style="background:LightGrey; color:black"|Hotplate temperature | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
25 - 200 °C | 25 - 200 °C | ||
|- | |- | ||
|style="background:LightGrey; color:black"|Cool plate temperature | |style="background:LightGrey; color:black"|Cool plate temperature | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
21 °C | 21 °C | ||
|- | |- | ||
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | !style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates | ||
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Silicon and glass | Silicon and glass | ||
Resists and crystalbond are not allowed in the HMDS module | |||
|- | |- | ||
|style="background:LightGrey; color:black"|Batch | |style="background:LightGrey; color:black"|Batch | ||
|style="background:WhiteSmoke; color:black"| | |style="background:WhiteSmoke; color:black"| | ||
1 - 25 | 1 - 25 | ||
|- | |- | ||
|} | |} | ||
<sup>1)</sup> Requires tool change. | <sup>1)</sup> Requires tool change. | ||
<br clear="all" /> | <br clear="all" /> |
Latest revision as of 11:15, 3 February 2023
Spin Coater: Gamma UV
Spin Coater: Gamma UV was installed at DTU Nanolab in March 2015. It is a Gamma 2M cluster from Süss MicroTec with spin coating, HMDS vapour priming, and baking modules.
The system handles 4" and 6" wafers without size conversion, and can be set up to handle 2" or 8".
The coater is equipped with 3 different resist lines, as well as 1 syringe line:
- AZ MiR 701
- AZ nLOF 2020
- AZ 5214E
- Syringe, which can be used for various resists
The processes that are available on the system are developed by Nanolab. Upon request, it is possible to establish new processes. Use of the syringe requires special training, and would as a starting point require batches in excess of 20 wafers.
The user manual, quality control procedures and results, user APVs, and contact information can be found in LabManager - requires login
Process information
Purpose |
| |
---|---|---|
Resist |
| |
Performance | HMDS contact angle |
60 - 80° |
Coating thickness |
| |
Process parameters | Priming temperature |
120 °C |
Spin speed |
10 - 6000 rpm | |
Spin acceleration |
10 - 10000 rpm/s | |
Hotplate temperature |
25 - 200 °C | |
Cool plate temperature |
21 °C | |
Substrates | Substrate size |
|
Allowed materials |
Silicon and glass Resists and crystalbond are not allowed in the HMDS module | |
Batch |
1 - 25 |
1) Requires tool change.