Specific Process Knowledge/Thin film deposition/Deposition of Tungsten/Evaporation of W in Temescal: Difference between revisions

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Created page with "=Deposition of W in Temescal= During the e-beam deposition of Tungsten, extremely bright light and heat are generated! Lower density film than expected due to porosity. Consider using sputtering instead. Power 33W, stable rate, tooling 86%. Measured thickness 20 nm (XRR). <b>Wait for base pressure 3 10-7Torr before start.</b> {| border="2" cellspacing="2" cellpadding="2" colspan="3" |bgcolor="#98FB98" |'''Deposition of Tungsten. Dep. rate: 0.5Å/s, Thickness sp.:..."
 
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During the e-beam deposition of Tungsten, extremely bright light and heat are generated! Lower density film than expected due to porosity. Consider using sputtering instead.
During the e-beam deposition of Tungsten, extremely bright light and heat are generated! Lower density film than expected due to porosity. Consider using sputtering instead.


Power 33W, stable rate, tooling 86%. Measured thickness 20 nm (XRR).  
Power 33W, stable rate, tooling 86%. Measured thickness 20 nm ([[Specific Process Knowledge/Characterization/XRD/XRD_SmartLab|XRR]]).  


<b>Wait for base pressure 3 10-7Torr before start.</b>
<b>Wait for base pressure 3 10-7Torr before start.</b>
Line 77: Line 77:


<gallery caption="XRR analysis of e-beam deposited Ta thin film." widths="500px" heights="500px" perrow="1">
<gallery caption="XRR analysis of e-beam deposited Ta thin film." widths="500px" heights="500px" perrow="1">
image:eves_20220225_W_Temescal.png| X-ray reflectivity. Measurement and Fit. Tooling 86%. <b>Seems that this deposition suffered from a high oxidation level. (low fitted density of the main Ta layer) or poures formation</b>
image:eves_20220225_W_Temescal.png| [[Specific Process Knowledge/Characterization/XRD/XRD_SmartLab|X-ray reflectivity]]. Measurement and Fit. Tooling 86%. <b>Seems that this deposition suffered from a high oxidation level. (low fitted density of the main Ta layer) or poures formation</b>
</gallery>
</gallery>

Revision as of 16:11, 2 January 2023

Deposition of W in Temescal

During the e-beam deposition of Tungsten, extremely bright light and heat are generated! Lower density film than expected due to porosity. Consider using sputtering instead.

Power 33W, stable rate, tooling 86%. Measured thickness 20 nm (XRR).

Wait for base pressure 3 10-7Torr before start.


Deposition of Tungsten. Dep. rate: 0.5Å/s, Thickness sp.: 20nm
Tooling factor 86% 2022-02-25
Layer name Thickness (nm) Density (g/cm3) Rougness (nm) Delta Beta
Moisture 0.80 0.52 0.52 1.7906e-6 4.1579e-8
WOx

1.01

 5.00 0.72 1.6991e-5 3.9456e-7
W

19.12

 15.66 0.81 3.7045e-5 2.9324e-6
SiO2 (native oxide) 2.09 2.15 0.32 7.0136e-6 1.6287e-7
Si (wafer) 2.33 0.00 7.5860e-6 1.7616e-7


  • XRR analysis of e-beam deposited Ta thin film.
  • X-ray reflectivity. Measurement and Fit. Tooling 86%. Seems that this deposition suffered from a high oxidation level. (low fitted density of the main Ta layer) or poures formation
    X-ray reflectivity. Measurement and Fit. Tooling 86%. Seems that this deposition suffered from a high oxidation level. (low fitted density of the main Ta layer) or poures formation
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