Specific Process Knowledge/Etch/DRIE/Pegasus/DREM/DREM 3kW 100%: Difference between revisions

From LabAdviser
VisualWikitext
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,416 edits
Created page with "{| border="2" cellpadding="0" cellspacing="0" style="text-align:center;" |- ! rowspan="2" width="40"| Date ! colspan="2" width="120"| Substrate Information ! colspan="4" | Pro..."
 
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,416 edits
No edit summary
 
Line 1: Line 1:
<!-- Page reviewed 9/8-2022 jmli -->
{| border="2" cellpadding="0" cellspacing="0" style="text-align:center;"
{| border="2" cellpadding="0" cellspacing="0" style="text-align:center;"
|-
|-

Latest revision as of 10:29, 9 August 2022


Date Substrate Information Process Information Results
Wafer info Material/ Exposed area Condi- tioning Recipe Wafer ID Comments SEM images Picoscope Numbers
27/11-2019 Medusa One AZ Mir Si / 10% stab-19 TDESC clean5, RF MU runs nanolab/ vy / DREM / DREM 3kW 100% 120 cycles or 10:0 minutes S018605 Process log entry

SEM image: a580 a582 a583 a584 a586 a587 a588 a589 a591 a592 a593
Trench width (um) 250.32 160.36 80.48 40.42 25.42 16.66 10.43 8.38 5.02 2.95 3
Etched depth (um) 144.98 143.11 138.38 126.78 116.06 105.34 93.04 87.39 76.48 65.37 62.15
Etch rate (um/min) 14.5 14.31 13.84 12.68 11.61 10.53 9.3 8.74 7.65 6.54 6.22
Etch rate (nm/cyc) 1.21 1.19 1.15 1.06 0.97 0.88 0.78 0.73 0.64 0.54 0.52
Sidewall bowing (%) -0.53 -0.63 -0.12 -0.08 0.14 0.33 0.54 0.65 0.71 0.43 0.59
Sidewall angle (degs) 92.18 92.25 91.6 91.51 91.32 91.19 91.02 90.92 90.88 90.99 90.48
Bottom bowing (%) 6.79 9.32 14.81 17.52 16.14 18.1 17.8 21.85 21.87 31.29 26.32
Aspect ratio 0.57 0.86 1.64 2.9 4.13 5.59 7.7 8.93 12.35 16.03 17.63
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/DRIE/Pegasus/DREM/DREM_3kW_100%25&oldid=41009"