Specific Process Knowledge/Etch/Aluminum Oxide/Al2O3 Etch with ICP Metal: Difference between revisions

From LabAdviser
Jump to navigation Jump to search
No edit summary
No edit summary
Line 24: Line 24:
|30
|30
|-
|-
==Al2O3 etching by sanvis@nanolab==
|Pressure [mTorr]
|Pressure [mTorr]
|4
|4

Revision as of 14:42, 20 June 2022

Feedback to this page: click here


Al2O3 etching with the ICP metal

Al2O3 etching by sanvis@nanolab

Parameter Recipe name: no name (testing recipe)
Coil Power [W] 1200
Platen Power [W] 200
Platen temperature [oC] 0
BCl3 flow [sccm] 60
Cl2 flow [sccm] 30
Pressure [mTorr] 4


Material to be etched Etch rate using the above parameters
Al2O3
  • ~93nm/min (30s, 1/4 wafer on 6" carrier)
    2017-01-20 bghe@nanolab