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== Etch processes designed for stepper resists == | == Etch processes designed for stepper resists == | ||
Latest revision as of 15:14, 24 August 2021
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Etch processes designed for stepper resists
The stepper produces features down to 200 nm. Here, etch processes especially designed for stepper patterns and resists are described. We intend to develop them continuously so keep an eye on this page. The best ones so far are:
| Recipe | Step | Temp. | Deposition step | Etch step | Process | ||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Time | Pressure | C4F8 | SF6 | O2 | Coil | Time | Pressure | C4F8 | SF6 | O2 | Coil | Platen | HW | Runs | Keywords | ||||||||||
| B | M | B | M | B | M | B | M | B | M | B | M | B | M | ||||||||||||
| NBoost04 | A | 20 | 2.8 | 5 | 60 | 0 | 0 | 500 | 1.5 | 3.5 | 30% | 5 | 0 | 20 | 100 | 100 | 0 | 0 | 500 | 500 | 50 | 10 | LF+B100 | 2 | VERY nice: scallops, straight sidewalls |
| Recipe | Step | Temp. | Deposition step | Etch step | Process observations | |||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Time | Pressure | C4F8 | SF6 | O2 | Coil | Time | Pressure | C4F8 | SF6 | O2 | Coil | Platen | HW | Runs | Key words | |||
| polySOI-10 | etch | 20 | 2.5 | 10 | 50 | 0 | 0 | 600 | 5 | 10 | 20 | 60 | 5 | 400 | 40 | - | 5 | very nice, blurred scallops |
| polySOI-10a | etch | 20 | 2.5 | 10 | 50 | 0 | 0 | 600 | 5 | 10 | 10 | 70 | 5 | 400 | 40 | - | 200+ | Works only with limited open area - probably less than 20 %, very stable, excellent and extensive track record |
With units
| Recipe | Step | Temp. | Deposition step | Etch step | Process | ||||||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Time | Pressure | C4F8 | SF6 | O2 | Coil | Time | Pressure | C4F8 | SF6 | O2 | Coil | Platen | HW | Runs | Keywords | ||||||||||
| B | M | B | M | B | M | B | M | B | M | B | M | B | M | ||||||||||||
| degs | s | mt | sccm | sccm | sccm | W | s | s | % | mt | sccm | sccm | sccm | sccm | sccm | sccm | W | W | W | W | |||||
| NBoost04 | A | 20 | 2.8 | 5 | 60 | 0 | 0 | 500 | 1.5 | 3.5 | 30% | 5 | 0 | 20 | 100 | 100 | 0 | 0 | 500 | 500 | 50 | 10 | LF+B100 | 2 | VERY nice: scallops, straight sidewalls |
| Recipe | Step | Temp. | Deposition step | Etch step | Process observations | |||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| Time | Pressure | C4F8 | SF6 | O2 | Coil | Time | Pressure | C4F8 | SF6 | O2 | Coil | Platen | HW | Runs | Key words | |||
| degs | s | mt | sccm | sccm | sccm | W | s | mt | sccm | sccm | sccm | W | W | |||||
| polySOI-10 | etch | 20 | 2.5 | 10 | 50 | 0 | 0 | 600 | 5 | 10 | 20 | 60 | 5 | 400 | 40 | - | 5 | very nice, blurred scallops |
| polySOI-10a | etch | 20 | 2.5 | 10 | 50 | 0 | 0 | 600 | 5 | 10 | 10 | 70 | 5 | 400 | 40 | - | 200+ | Works only with limited open area - probably less than 20 %, very stable, excellent and extensive track record |