Specific Process Knowledge/Etch/DRIE-Pegasus/DUVetch: Difference between revisions

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'''Feedback to this page''': '''[mailto:labadviser@nanolab.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.nanolab.dtu.dk/index.php/Specific_Process_Knowledge/Etch/DRIE-Pegasus/DUVetch click here]'''
<!--Checked for updates on 14/5-2018 - ok/jmli -->
<!--Checked for updates on 24/8-2021. ok/ jmli-->
== Etch processes designed for stepper resists ==
The stepper produces features down to 200 nm. Here, etch processes especially designed for stepper patterns and resists are described. We intend to develop them continuously so keep an eye on this page. The best ones so far are:
{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;"
{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;"
|+ '''Process parameters'''
|+ '''Process parameters'''
Line 24: Line 32:
! width="40" rowspan="2"| [[Specific Process Knowledge/Etch/DRIE-Pegasus/Parameters#Hardware | HW]]  
! width="40" rowspan="2"| [[Specific Process Knowledge/Etch/DRIE-Pegasus/Parameters#Hardware | HW]]  
! width="40" rowspan="2"| Runs
! width="40" rowspan="2"| Runs
! width="40" rowspan="2"| Keywords
! width="300" rowspan="2"| Keywords
|-
|-
! width="20" | B
! width="20" | B
Line 97: Line 105:
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/Parameters#Hardware | HW]]  
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/Parameters#Hardware | HW]]  
! width="40" | Runs
! width="40" | Runs
! width="100" | Key words
! width="300" | Key words
|-
! polySOI-10    <!-- recipe name -->
| etch      <!-- step -->
| 20      <!-- chiller temp -->
| 2.5      <!-- dep time -->
| 10      <!-- dep pressure -->
| 50      <!-- C4F8 flow -->
|  0      <!-- SF6 flow -->
|  0    <!-- O2 flow -->
| 600      <!-- coil power -->
| 5      <!-- etch time -->
| 10      <!-- etch pressure -->
| 20      <!-- C4F8 flow -->
| 60      <!-- SF6 flow -->
| 5      <!-- O2 flow -->
| 400      <!-- coil power -->
|  40      <!-- platen power -->
| -      <!-- hardware setting -->
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/DUVetch/polySOI10 | 5]]      <!-- link processes -->
| very nice, blurred scallops    <!-- keywords -->
|-
! polySOI-10a    <!-- recipe name -->
| etch      <!-- step -->
| 20      <!-- chiller temp -->
| 2.5      <!-- dep time -->
| 10      <!-- dep pressure -->
| 50      <!-- C4F8 flow -->
|  0      <!-- SF6 flow -->
|  0    <!-- O2 flow -->
| 600      <!-- coil power -->
| 5      <!-- etch time -->
| 10      <!-- etch pressure -->
| 10      <!-- C4F8 flow -->
| 70      <!-- SF6 flow -->
| 5      <!-- O2 flow -->
| 400      <!-- coil power -->
|  40      <!-- platen power -->
| -      <!-- hardware setting -->
! [[Specific Process Knowledge/Etch/DRIE-Pegasus/DUVetch/polySOI10a | 200+]]      <!-- link processes -->
| Works only with limited open area - probably less than 20 %, very stable, excellent and extensive track record    <!-- keywords -->
|-
 
|}
 
 
 
= With units =
 
{| border="2" cellpadding="2" cellspacing="1" style="text-align:center;"
|+ '''Process parameters'''
|-
! rowspan="4" width="100"| Recipe
! rowspan="4" width="20"| Step
! rowspan="3" width="20"| Temp.
! colspan="6" | Deposition step
! colspan="14" | Etch step
! colspan="3" | Process
|-
! width="40" rowspan="2"| Time
! width="40" rowspan="2"| Pressure
! width="40" rowspan="2"| C<sub>4</sub>F<sub>8</sub>
! width="40" rowspan="2"| SF<sub>6</sub>
! width="40" rowspan="2"| O<sub>2</sub>
! width="40" rowspan="2"| Coil
! width="40" colspan="2"| Time
! width="40" colspan="2"| Pressure
! width="40" colspan="2"| C<sub>4</sub>F<sub>8</sub>
! width="40" colspan="2"| SF<sub>6</sub>
! width="40" colspan="2"| O<sub>2</sub>
! width="40" colspan="2"| Coil
! width="40" colspan="2"| Platen
! width="40" rowspan="3"| [[Specific Process Knowledge/Etch/DRIE-Pegasus/Parameters#Hardware | HW]]
! width="40" rowspan="3"| Runs
! width="300" rowspan="3"| Keywords
|-
! width="20" | B
! width="20" | M
! width="20" | B
! width="20" | M
! width="20" | B
! width="20" | M
! width="20" | B
! width="20" | M
! width="20" | B
! width="20" | M
! width="20" | B
! width="20" | M
! width="20" | B
! width="20" | M
|-
| degs
| s
| mt
| sccm
| sccm
| sccm
| W
| s
| s
| %
| mt
| sccm
| sccm
| sccm
| sccm
| sccm
| sccm
| W
| W
| W
| W
|-
! NBoost04  <!--recipe name  -->
| A  <!-- step -->
| 20  <!-- chiller temperature -->
! 2.8  <!-- dep time -->
| 5  <!-- dep pressure -->
| 60  <!-- dep C4F8 flow -->
| 0    <!-- dep SF6 flow -->
| 0  <!-- dep O2 flow -->
| 500  <!-- dep coil power -->
| 1.5  <!-- etch:boost time-->
| 3.5  <!-- etch:main time -->
| 30%  <!-- etch:boost pressure-->
| 5  <!-- etch:main pressure -->
| 0  <!-- etch:boost C4F8 flow-->
| 20  <!-- etch:main C4F8 flow -->
| 100  <!-- etch:boost SF6 flow-->
| 100  <!-- etch:main SF6 flow -->
| 0  <!-- etch:boost O2 flow-->
| 0  <!-- etch:main O2 flow -->
| 500    <!-- etch:boost coil power-->
| 500  <!-- etch:main coil power -->
| 50    <!-- etch:boost platen power-->
| 10    <!-- etch:main platen power -->
| LF+B100    <!-- etch:boost -->
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/DUVetch/nBoost04 | 2]]      <!-- link processes -->
|width="120"|  VERY nice: scallops, straight sidewalls <!-- key words -->
|-
|}
 
 
{| border="1" cellpadding="1" cellspacing="1" style="text-align:center;"
|+ '''Process parameters'''
|-
! rowspan="3" width="100"| Recipe
! rowspan="3" width="20"| Step
! rowspan="2" width="20"| Temp.
! colspan="6" | Deposition step
! colspan="7" | Etch step
! colspan="3" | Process observations
 
|-
! width="40" | Time
! width="40" | Pressure
! width="40" | C<sub>4</sub>F<sub>8</sub>
! width="40" | SF<sub>6</sub>
! width="40" | O<sub>2</sub>
! width="40" | Coil
! width="40" | Time
! width="40" | Pressure
! width="40" | C<sub>4</sub>F<sub>8</sub>
! width="40" | SF<sub>6</sub>
! width="40" | O<sub>2</sub>
! width="40" | Coil
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/Parameters#Platen power|Platen]]
| rowspan="2" | [[Specific Process Knowledge/Etch/DRIE-Pegasus/Parameters#Hardware | HW]]
! width="40" rowspan="2" | Runs
! width="300" rowspan="2" | Key words
|-
| degs
| s
| mt
| sccm
| sccm
| sccm
| W
| s
| mt
| sccm
| sccm
| sccm
| W
| W
|-
|-
! polySOI-10    <!-- recipe name -->
! polySOI-10    <!-- recipe name -->
Line 137: Line 329:
| -      <!-- hardware setting -->
| -      <!-- hardware setting -->
! [[Specific Process Knowledge/Etch/DRIE-Pegasus/DUVetch/polySOI10a | 200+]]      <!-- link processes -->
! [[Specific Process Knowledge/Etch/DRIE-Pegasus/DUVetch/polySOI10a | 200+]]      <!-- link processes -->
| very stable, excellent and extensive track record    <!-- keywords -->
| Works only with limited open area - probably less than 20 %, very stable, excellent and extensive track record    <!-- keywords -->
|-
|-


|}
|}

Latest revision as of 15:14, 24 August 2021

Feedback to this page: click here

Etch processes designed for stepper resists

The stepper produces features down to 200 nm. Here, etch processes especially designed for stepper patterns and resists are described. We intend to develop them continuously so keep an eye on this page. The best ones so far are:

Process parameters
Recipe Step Temp. Deposition step Etch step Process
Time Pressure C4F8 SF6 O2 Coil Time Pressure C4F8 SF6 O2 Coil Platen HW Runs Keywords
B M B M B M B M B M B M B M
NBoost04 A 20 2.8 5 60 0 0 500 1.5 3.5 30% 5 0 20 100 100 0 0 500 500 50 10 LF+B100 2 VERY nice: scallops, straight sidewalls


Process parameters
Recipe Step Temp. Deposition step Etch step Process observations
Time Pressure C4F8 SF6 O2 Coil Time Pressure C4F8 SF6 O2 Coil Platen HW Runs Key words
polySOI-10 etch 20 2.5 10 50 0 0 600 5 10 20 60 5 400 40 - 5 very nice, blurred scallops
polySOI-10a etch 20 2.5 10 50 0 0 600 5 10 10 70 5 400 40 - 200+ Works only with limited open area - probably less than 20 %, very stable, excellent and extensive track record


With units

Process parameters
Recipe Step Temp. Deposition step Etch step Process
Time Pressure C4F8 SF6 O2 Coil Time Pressure C4F8 SF6 O2 Coil Platen HW Runs Keywords
B M B M B M B M B M B M B M
degs s mt sccm sccm sccm W s s % mt sccm sccm sccm sccm sccm sccm W W W W
NBoost04 A 20 2.8 5 60 0 0 500 1.5 3.5 30% 5 0 20 100 100 0 0 500 500 50 10 LF+B100 2 VERY nice: scallops, straight sidewalls


Process parameters
Recipe Step Temp. Deposition step Etch step Process observations
Time Pressure C4F8 SF6 O2 Coil Time Pressure C4F8 SF6 O2 Coil Platen HW Runs Key words
degs s mt sccm sccm sccm W s mt sccm sccm sccm W W
polySOI-10 etch 20 2.5 10 50 0 0 600 5 10 20 60 5 400 40 - 5 very nice, blurred scallops
polySOI-10a etch 20 2.5 10 50 0 0 600 5 10 10 70 5 400 40 - 200+ Works only with limited open area - probably less than 20 %, very stable, excellent and extensive track record
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