Specific Process Knowledge/Characterization: Difference between revisions
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===[[/SEM: Scanning Electron Microscopy|SEM: Scanning Electron Microscopy]]=== | ===[[/SEM: Scanning Electron Microscopy|SEM: Scanning Electron Microscopy]]=== | ||
*FEI SEM | *[[/SEM: Scanning Electron Microscopy#FEI_SEM|FEI SEM]] | ||
* | *[[/SEM: Scanning Electron Microscopy#LEO_SEM|LEO SEM]] | ||
* | *[[/SEM: Scanning Electron Microscopy#JEOL_SEM|JEOL SEM]] | ||
===[[/AFM: Atomic Force Microscopy|AFM: Atomic Force Microscopy]]=== | ===[[/AFM: Atomic Force Microscopy|AFM: Atomic Force Microscopy]]=== | ||
Revision as of 09:36, 29 October 2007
Choose topic
- Surface imaging
- Topographic measurement
- Stress measurement
- Measurement of optical constants
- Film thickness measurement
- Wafer thickness measurement
- Element analysis
- Hydrophobicity measurement
- Resistivity measurement
- Other electrical measurements
Choose equipment
SEM: Scanning Electron Microscopy
AFM: Atomic Force Microscopy
- Nanoman - AFM
Profiler
- Dektak 8 stylus profiler
- Tencor
Optical microscope
Optical characterization
- Ellipsometer
- Filmtek
- Prism Coupler
SIMS: Secondary Ion Mass Spectrometry
- Atomika SIMS