Specific Process Knowledge/Lithography/EBeamLithography/SDF-TRAINING

This is a SDF for Jeol E-beam, be aware that the working file can be found under Equitment documents in labadviser, do NOT copy this, since it most like will not work!

MAGAZIN    'TRAINING'

;------------------------------------------------------------

#10               	           	    
%3C               	            	
JDF     'Training',1 		
ACC 100                     	     
CALPRM '10na_ap7'      	        
WARMUP 120					; Only if need waiting time before exposure
DEFMODE 2                    		

RESTOR1

GLMDET M					; only used for Alignment		  
CHIPAL 0					; only used for Alignment  
HSWITCH OFF,OFF			                ; only used for Alignment

RESIST 1000                    
SHOT A,16                      
OFFSET(0,0)                   

;-------------------------------------------------------------
     
END 10                         



;--------------------- TEMPLATE WITH COMMENTS -----------------


This is a SDF file template that can be used in Jeol 9500 for file compilation.
The top section is a working SDF that can be modified to your needs.
A SDF file (Schedule deck file) always need a JDF counterpart
A SDF can contain multiple sections, thereby giving possibility to expose from different cassettes, with different currents or different JDF files
It is recomended to name your SDF, JDF and V30 files the same and like this: initials date something else. eg. lgpe200130Align 

A SDF file must start with: capital letters "MAGAZIN" 'TRAINING' then in ´NAME´ a idetification name max 8 characters all capital, no special characters   ; 

It is recommended to make division lines to distinguish start and end of sections
A semicolon ; makes whatever comes next a comment and is neglected by the E-beam when compiling
All comands must be CAPITAL letters
Some of the commands must come in a specific order, it is therefore recommended to keep the order of the command lines as written here
For more detailed information please read the "Sdf-jdf file preparation manual on LabAdviser" found in the E-beam/Jeol section 

;---------------------------------------------------------------

	#10               	    ; #1-10: Select which cassette is taken from the autoloader cassette 5-10 is dedicated positions:
				    ; #5:Al chip, #6 Al 2", #7: Al 4", #8 Ti 4", #9 Ti2", #10 Ti chip cassette  

	%3A               	    ; %3A is size and slot position in the cassette. Use 3 for chip cassette. 
				    ; On the cassette front with hook on right side, the positions are named from top left to right and then down (as reading)
				    ; Hence A (top left), B (top right), C (middle/lower left) etc. The 4" Al cassette (#7) is called D, E though  

	JDF     'Training',1        ; This calls the JDF in 'Training' to be used, if multiple JDF's are needed make several sections 
				    ; ,1 denotes a meta layer most people do not use, please just leave it be 

	ACC 100                     ; Acceleration voltage of 100keV is used, cannot be changed on the Jeol 9500 (keep this command line) 

	CALPRM '0.2na_ap4'          ; CALibrationPRograM is called condition file in the E-beam, it specifies the current and aperture needed
				    ; Low current higher resolution and smoother sidewalls, but slower. Large current faster but loosing resolution
				    ; The current and aperture value must fit together, hence look in Calib on the E-beam to find the correct combination
				    ; '0.2na_ap4' only use condition files with a name like this, never backup, PXSHI, Jeol or ending _2D

	DEFMODE 2                   ;2 deflector system, primary (1x1mm) subditary (4x4µm) Both deflectors are used (default, do not change)

;----- Double current exposure - Bulk and sleeve -----

RESTOR1				    ; If Bulk and sleeve/double current is needed, the command RESTOR1 will restore the conditions in the column for the new current
				    ; For Bulk and sleeve/double current it goes: calibrate high->low current, expose Low-> high current

; ---- Alignment----

	GLMDET M		    ; GLobalMarkDETection Manual global mark detection is used. Global marks are called P (left or top) and Q marks (right or bottom)

	CHIPAL 4		    ; CHIPAlignment 4 chip marks are used for alignment. This is used for more accurate alignment of smaller chips

	HSWITCH OFF,ON		    ; HeightSWITCH denotes which marks global or chip that is used for height meassurement. 

; -----End Alignment ----


	RESIST 600                  ; RESIST denotes the base dosed used, if modulation is applied in the JDF it modulates from the basedose, a dose of 600 µC/cm2 is used here 

	SHOT A,8                    ; SHOT A, represent pitch between individual beam shots - steps of 0.25 nm - directly correlated with dose and and current to change Dwelltime



	END 10			    ; After exposure, casette 10 remains on the stage - recommemded to keep END same value as # Always!

More commands are available, please refer to the JEOL manual or contact the responsible person.