Specific Process Knowledge/Thin film deposition/Deposition of Gold: Difference between revisions

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== Studies of Au deposition processes ==
[[/Roughness of Au|Roughness of Au layers]] - ''Roughness of Au layers deposited with different equipment and settings''

Revision as of 15:45, 16 December 2008

Gold can be deposited by e-beam evaporation. In the chart below you can compare the different deposition equipment.


E-beam evaporation (Alcatel) E-beam evaporation (Leybold) E-beam evaporation (Wordentec) Sputter (Lesker)
Batch size
  • Up to 1x4" wafers
  • smaller pieces
  • 8x4" wafers or
  • 5x6" wafers
  • 24x2" wafers or
  • 6x4" wafers or
  • 6x6" wafers
  • up to 1x6" wafer
Pre-clean RF Ar clean Ar ion bombartment RF Ar clean RF Ar clean
Layer thickness 10Å to 1µm 10Å to 1500 Å 10Å to 1 µm 10Å to
Deposition rate 2Å/s to 15Å/s 1Å/s to 5Å/s 10Å/s to 15Å/s



Studies of Au deposition processes

Roughness of Au layers - Roughness of Au layers deposited with different equipment and settings

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