Specific Process Knowledge/Characterization: Difference between revisions
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*[[LabAdviser/CEN/Inspect S|SEM Inspect S]] | *[[LabAdviser/CEN/Inspect S|SEM Inspect S]] | ||
=== | ===SEMs at Danchip=== | ||
*[[/SEM: Scanning Electron Microscopy |SEM Comparison page]] | *[[/SEM: Scanning Electron Microscopy |SEM Comparison page]] | ||
*[[/SEM LEO|SEM LEO]] | *[[/SEM LEO|SEM LEO]] | ||
Revision as of 14:09, 18 October 2018
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Overview of characteristics and where to measure it
| Optical Micro- scopes | SEM (incl. EDX) | AFM | Stylus profiler | Optical profiler | Filmtek (reflec- tometer) | Ellip- someter | Thickness stylus | XPS | PL mapper | 4-point probe | Probe station | XRD | Life time scanner | Drop shape analyser | Hardness tester | DSC Perkin Elmer | |
| Thin film thickness | x 1) | x 1) | x 2) | x 2) | x | x | x | x 5) | x 3) | x | |||||||
| Defects | x | x | |||||||||||||||
| Wafer thickness | x 1) | x 1) | x | ||||||||||||||
| Step coverage | x 1) | x 1) | |||||||||||||||
| Particles | x | x | x | ||||||||||||||
| Element analysis | x | x | x 4) | x 4) | |||||||||||||
| Surface roughness | x | x | x | ||||||||||||||
| Deposition uniformity | x | x | x | ||||||||||||||
| Film stress | x | x | |||||||||||||||
| Refractive index | x | x | |||||||||||||||
| Reflectivity | x | x | (x) | ||||||||||||||
| Resistivity | x | ||||||||||||||||
| Breakdown voltage | |||||||||||||||||
| Electrical conductivity | x | ||||||||||||||||
| Thermal conductivity | |||||||||||||||||
| Optical gap | x | x | |||||||||||||||
| Crystalinity | x | ||||||||||||||||
| Charge carrier life time | x | ||||||||||||||||
| Contact angle hydrophobic/hydrophillic | x | ||||||||||||||||
| Material Hardness | x | ||||||||||||||||
| Voids in wafer bonding | x | ||||||||||||||||
- Using the cross section method
- Using the create step method
- With known resistivity
- Composition information for crystalline materials
- Only single layer
Choose characterization topic
- Element analysis
- Measurement of film thickness and optical constants
- Photoluminescence mapping
- Sample imaging
- Sample preparation for inspection
- Stress measurement
- Hardness measurement
- Wafer thickness measurement
- Topographic measurement
- Contact angle measurement
- Four-Point Probe (Resistivity measurement)
- Carrier density (doping) profiler
- Scanning Electron Microscopy
Choose equipment
AFM
Element analysis
Optical and stylus profilers
Optical microscopes
Optical characterization
- Ellipsometer
- Filmtek 4000
- Prism Coupler
- PL mapper - Photoluminescence mapper
- Lifetime scanner MDPmap
SEMs at CEN
- FIB-SEM FEI QUANTA 200 3D
- Dual Beam FEI Helios Nanolab 600
- SEM FEI Nova 600 NanoSEM
- SEM FEI Quanta 200 ESEM FEG
- SEM Inspect S