Specific Process Knowledge/Lithography/Aligners/Aligner: Maskless 01 processing: Difference between revisions
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==Defocus== | ==Defocus== | ||
The optimal defocus setting is probable a function of the resist thickness, but for 1.5µm resist, a defocus of -4 seems to be optimal. | |||
=Substrate positionning= | =Substrate positionning= | ||
Revision as of 15:17, 18 December 2017
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General Process Information
Exposure dose
The exposure dose needed inn the Aligner: Maskless 01 seems to follow the dose needed to process the same substrate in KS Aligner. As doses get higher, there is a tendency for the dose needed in the Aligner: Maskless 01 to exceed the dose needed in KS Aligner.
Defocus
The optimal defocus setting is probable a function of the resist thickness, but for 1.5µm resist, a defocus of -4 seems to be optimal.