Specific Process Knowledge/Etch/Etching of Silicon Oxide/SiO2 etch using RIE1 or RIE2/Images of 1SIO2mbr with burned resist mask: Difference between revisions

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===Etch of SiO2 using the recipe 1SIO2mbr with burned resist as masking material, by Berit Geilman Herstrøm (BGE) from Danchip@DTU===
===Etch of SiO2 using the recipe 1SIO2mbr with burned resist as masking material ===
''Berit Geilman Herstrøm (BGE) from Danchip@DTU''


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Revision as of 08:36, 29 June 2017

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Etch of SiO2 using the recipe 1SIO2mbr with burned resist as masking material

Berit Geilman Herstrøm (BGE) from Danchip@DTU

Process date: Before 2004
Recipe: 1sio2mbr
Process time: ? min
Mask: Burned resist
Structure size on mask: 3 µm
Etch rate ~120nm/min
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