Specific Process Knowledge/Thin film deposition/Si sputter in Wordentec: Difference between revisions

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Please don´t use higher power then 180W, since the target then could break into a lot of small pieces.
Please don´t use higher power then 180W, since the target then could break into a lot of small pieces.  


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Revision as of 15:21, 16 January 2017

Silicon sputter

Silicon can be sputter deposited in Wordentec.


Parameters

Listed below are tried parameters, that can be used during deposition. Use the rates as a start value, and make a test to be sure that you get the right thickness.


Please don´t use higher power then 180W, since the target then could break into a lot of small pieces.

Settings 1 Settings 2
Process type Sputtering Sputtering
Power 130W 170W
Sputter pressure 5*10-3 1*10-2
Rate About 0,7 Å/s About 0,6 Å/s