Specific Process Knowledge/Characterization

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Choose characterization topic

• Element analysis
• Measurement of film thickness and optical constants
• Photoluminescence mapping
• Sample imaging
• Sample preparation for inspection
• Stress measurement
• Wafer thickness measurement
• Topographic measurement

• Contact angle measurement
• Four-Point Probe (Resistivity measurement)
• Carrier density (doping) profiler
• Scanning Electron Microscopy
• Transmission Electron Microscopy

Choose equipment

AFM

• AFM - Atomic Force Microscopy

Element analysis

• Atomika SIMS
• XPS-ThermoScientific

Optical and stylus profilers

• Optical Profiler (Sensofar)
• Dektak XTA_new
• Dektak 8 stylus profiler
• III V Profiler

Optical microscopes

• Optical microscope

Optical characterization

• Ellipsometer
• Filmtek 4000
• Prism Coupler
• PL mapper - Photoluminescence mapper

SEM's at CEN

• FIB-SEM FEI QUANTA 200 3D
• Dual Beam FEI Helios Nanolab 600
• SEM FEI Nova 600 NanoSEM
• SEM FEI Quanta 200 ESEM FEG
• SEM Inspect S

SEM's at Danchip

• SEM LEO
• SEM JEOL
• SEM Zeiss
• SEM Zeiss Supra 60 VP
• SEM Supra 3

TEM's at CEN

• Titan ATEM
• Titan ETEM
• Tecnai TEM

Various

• Drop Shape Analyzer

• 4-Point Probe

• Thickness Measurer

• Probe station

• KLA-Tencor Surfscan 6420
• III-V ECV-profiler (Electrochemical Capacitance-Voltage carrier density profiler)
• X-Ray Diffractometer