Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessA: Difference between revisions

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{| border="2" cellpadding="0" cellspacing="0" style="text-align:center;"
|+ '''Process runs'''
|-
! rowspan="2" width="40"| Date
! colspan="4" width="120"| Substrate Information
! colspan="4" | Process Information
! rowspan="2" width="500" |SEM Images
|-
! width="30" | Wafer info
! width="40" | Mask
! width="40" | Material/ Exposed area
! width="40" | Tool / Operator
! width="40" | Conditioning
! width="40" | Recipe
! width="40" | Wafer ID
! width="40" | Comments
|-
| 18/8-2014
| 4" Danchip QC Wafer
| 1.5 µm AZ resist, daq2 mask
| Si / 10 %
| Pegasus/jmli
| 10 minute TDESC clean, 10 minute PR strip post process
| danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes
| S004257
! OLD showerhead
|
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|-
|}




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! New showerhead  
! New showerhead  
|  
|  
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Revision as of 15:55, 16 December 2014


Process runs
Date Substrate Information Process Information SEM Images
Wafer info Mask Material/ Exposed area Tool / Operator Conditioning Recipe Wafer ID Comments
18/8-2014 4" Danchip QC Wafer 1.5 µm AZ resist, daq2 mask Si / 10 % Pegasus/jmli 10 minute TDESC clean, 10 minute PR strip post process danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes S004257 OLD showerhead

S004257-08.jpg S004257-09.jpg S004257-10.jpg S004257-11.jpg S004257-12.jpg S004257-13.jpg S004257-14.jpg

1/12-2014 4" Danchip QC Wafer 1.5 µm AZ resist, daq2 mask Si / 10 % Pegasus/jmli 10 minute TDESC clean, 10 minute PR strip post process danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes S004671 New showerhead

No SEM images due to bad cleaving

15/12-2014 4" Danchip QC Wafer 1.5 µm AZ resist, daq2 mask Si / 10 % Pegasus/jmli 10 minute TDESC clean, 10 minute PR strip post process danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes S004746 New showerhead

S004746-01.jpg S004746-02.jpg S004746-03.jpg S004746-04.jpg S004746-05.jpg S004746-06.jpg S004746-07.jpg

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