Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessA: Difference between revisions
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| 15/12-2014 | |||
| 4" Danchip QC Wafer | |||
| 1.5 µm AZ resist, daq2 mask | |||
| Si / 10 % | |||
| Pegasus/jmli | |||
| 10 minute TDESC clean, 10 minute PR strip post process | |||
| danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | |||
| S004746 | |||
! New showerhead | |||
| | |||
[[file:S004746-01.jpg|250px|frameless ]] | |||
[[file:S004746-02.jpg|250px|frameless ]] | |||
[[file:S004746-03.jpg|250px|frameless ]] | |||
[[file:S004746-04.jpg|250px|frameless ]] | |||
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Revision as of 15:51, 16 December 2014
| Date | Substrate Information | Process Information | SEM Images | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Wafer info | Mask | Material/ Exposed area | Tool / Operator | Conditioning | Recipe | Wafer ID | Comments | ||
| 1/12-2014 | 4" Danchip QC Wafer | 1.5 µm AZ resist, daq2 mask | Si / 10 % | Pegasus/jmli | 10 minute TDESC clean, 10 minute PR strip post process | danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | S004671 | New showerhead |
No SEM images due to bad cleaving |
| 15/12-2014 | 4" Danchip QC Wafer | 1.5 µm AZ resist, daq2 mask | Si / 10 % | Pegasus/jmli | 10 minute TDESC clean, 10 minute PR strip post process | danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | S004746 | New showerhead |
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