Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessA: Difference between revisions
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! width="40" | Comments | ! width="40" | Comments | ||
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| | | 1/12-2014 | ||
| 4" Danchip QC Wafer | | 4" Danchip QC Wafer | ||
| 1.5 µm AZ resist, daq2 mask | | 1.5 µm AZ resist, daq2 mask | ||
| Line 24: | Line 24: | ||
| 10 minute TDESC clean, 10 minute PR strip post process | | 10 minute TDESC clean, 10 minute PR strip post process | ||
| danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | | danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | ||
| | | S004671 | ||
! | ! New showerhead | ||
| | | | ||
No SEM images due to bad cleaving | |||
|- | |- | ||
|} | |} | ||
Revision as of 14:52, 16 December 2014
| Date | Substrate Information | Process Information | SEM Images | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Wafer info | Mask | Material/ Exposed area | Tool / Operator | Conditioning | Recipe | Wafer ID | Comments | ||
| 1/12-2014 | 4" Danchip QC Wafer | 1.5 µm AZ resist, daq2 mask | Si / 10 % | Pegasus/jmli | 10 minute TDESC clean, 10 minute PR strip post process | danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | S004671 | New showerhead |
No SEM images due to bad cleaving |