Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessA: Difference between revisions
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| | | 18/8-2014 | ||
| | | 4" Danchip QC Wafer | ||
| | | 1.5 µm AZ resist, daq2 mask | ||
| Si / | | Si / 10 % | ||
| Pegasus/jmli | | Pegasus/jmli | ||
| 10 minute TDESC clean | | 10 minute TDESC clean, 10 minute PR strip post process | ||
| danchip/ | | danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | ||
| | | S004257 | ||
! OLD showerhead | |||
| | | | ||
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Revision as of 13:08, 16 December 2014
| Date | Substrate Information | Process Information | SEM Images | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Wafer info | Mask | Material/ Exposed area | Tool / Operator | Conditioning | Recipe | Wafer ID | Comments | ||
| 18/8-2014 | 4" Danchip QC Wafer | 1.5 µm AZ resist, daq2 mask | Si / 10 % | Pegasus/jmli | 10 minute TDESC clean, 10 minute PR strip post process | danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | S004257 | OLD showerhead |
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