Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange: Difference between revisions

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| 6" wafer
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| S004679
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| Wafer centre

Revision as of 15:42, 10 December 2014

Comparison of processes before and after the change of showerhead in December 2014
Process Before After
Name/Type Description Wafer ID Comment SEM images Wafer ID Comment SEM images
Continuous black silicon recipe on blank wafer 15 mins, -10 degrees, 32 mtorr, 60 sccm SF6, 55 sccm O2, 70 W platen S004592 Wafer centre S004592 centre.jpg S004679 Wafer centre S004679 centre.jpg
S004592 Wafer edge S004592 edge.jpg S004679 Wafer edge S004679 edge.jpg
Switched etch of 1.8 µm polysilicon on BOX patterned with DUV 50 cycles, 30 degrees, 2.3/5 secs, 10/10 mtorr, 0/60 sccm SF6, 0/5 sccm O2, 50/20 sccm C4F8, 600/400 W coil, 0/40 W platen S004593 6" wafer

S00459305.jpg S00459306.jpg S00459307.jpg S00459308.jpg S004593-01.jpg S004593-02.jpg S004593-03.jpg S004593-04.jpg

S004679 Wafer centre S004679 centre.jpg
S004593 Wafer edge S004592 edge.jpg S004679 Wafer edge S004679 edge.jpg