Specific Process Knowledge/Lithography/Baking

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Comparing baking methods

	Hotplate: 90-110C	SU8 hotplates	Fumehood hotplates	Oven 90C	Oven: 120C - 250C	Oven 250C
Purpose	Programmable contact bake Soft bake, PEB	Programmable, ramped contact bake Soft bake and PEB of SU-8	Manual contact bake Soft bake	Manual convection bake Soft bake	Manual convection bake Hard bake	Manual convection bake Dehydration
Temperature	Maximum 120°C	Maximum 250°C	Maximum 300°C Maximum temperature may be limited on the individual hotplate	Fixed at 90°C	120 - 250°C Return to 120°C after use	Fixed at 250°C
Substrate size	50 mm wafers 100 mm wafers 150 mm wafers	pieces 50 mm wafers 100 mm wafers 150 mm wafers 200 mm wafers	pieces 50 mm wafers 100 mm wafers 150 mm wafers	100 mm wafers 150 mm wafers	100 mm wafers 150 mm wafers	100 mm wafers 150 mm wafers
Allowed materials	Silicon, glass, and polymer substrates Film or pattern of all types	Silicon, glass, and polymer substrates Film or pattern of all types except type IV	Respect the allowed materials on the associated spin coater	Silicon, glass, and polymer substrates Film or pattern of all types	Silicon, glass, and polymer substrates Film or pattern of all types	Silicon, glass, and high Tg polymer substrates Film or pattern of all types except resist
Restrictions		III-V, copper, steel substrates Pb, Te films	III-V substrates unless specifically stated Respect the restrictions on the associated spin coater	III-V substrates Pb, Te films	III-V, copper, steel substrates	Resist is not allowed

Hotplates

Hotplate: 90-110C

Location of Hotplate: 90-110C in C-1

Hotplate: 90-110C is used for baking of 2" - 6" wafers.

The user manual, and contact information can be found in LabManager: Hotplate: 90-110C

SU8 hotplates

Hotplate 1 (SU8) and Hotplate 2 (SU8) situated in C-1

We have two dedicated SU-8 hotplates in C-1.

Users can control the ramp-time, the baking temperature, and the baking time.

The user manual, and contact information can be found in LabManager: Hotplate 1 (SU8) Hotplate 2 (SU8)

Fumehood hotplates

Variable temperature hotplate mostly used for baking of single wafers as a soft baking step after a spin coating of photoresist.

• Fumehood hotplates
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  Fumehood hotplate for Manual Spinner (Polymers).

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  BHF in cleanroom C-1 (KOH bench 1+2.) The BHF bath is positioned between the two KOH baths. This is primarily used to remove oxide before and after a KOH etch.

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  BHF in cleanroom D-3 (KOH bench 6".) The BHF bath is positioned to the right. This is primarily used to remove oxide before and after a KOH etch.

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  PP-bath: positioned in the upper right corner of the fumehood in cleanroom B-1.

Ovens

Oven 90C

Oven 90 °C: positioned in C-1

The oven is mostly used for baking of several wafers at a time at 90 °C as a soft baking step after a spin coating of photoresist. For 1.5µm resist the baking time is 30 min. For most of the other resist thicknesses it is also 30 min.

The user manual, and contact information can be found in LabManager: Oven 90C

Oven: 120C - 250C

Variable temperature convection oven mostly used for baking of wafers as a hard baking step after development of photoresist. The set-point can be varied, but should always be returned to 120°C after use.

The user manual, and contact information can be found in LabManager: Oven: 120C - 250C

Oven 250C for pretreatment

Oven 250C for pretreatment: positioned in C-1

See Oven 250C